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Automatic Die Handler DH6
Flexible machine for full automatic die handling. Die pick-up from blue tape, flipping, and die transfer into multiple die presentations of various designs. Automatic Die Handler DH6 is an additional module for the automatic flip chip bonding systems FINEPLACER® Pico AMA and FINEPLACER® Micro AMA.
Benefits:
Safe die handling by gentle die pick-up and minimized handling stress
Low pick-up forces
Automatic or step-by-step mode
Integrated pattern recognition system with ink dot detection
Windows®-based graphical user interface with wafer mapping function
Flexibly adaptable to different die sizes and materials
Different transfer lengths are adaptable for various system adaptations
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Technical Specifications |
| Presentation Area: |
100 mm x 100 mm |
| Max. Wafer Dia: |
8'' (OEM) |
| Max. Pick-up Area: |
150 mm x 150 mm |
| Die Sizes: |
0.5 x 0.5 up to 8 x 8 mm |
| Die Output: |
Multiple waffle or GelPak® |
*the configuration shown on the picture contains optional modules |
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