Please look at the following menu and choose your specific technology. All of these can be performed with the FINEPLACER® system. In case you are missing one, please contact us via E-mail or simply give us a call. We will do our best to help you.
Adhesive materials can be applied between two join partners, e.g. dice and substrates in various ways: dispensing, stencil printing, pin transfer or as film working as intermediate connection. Depending on your needs, you can choose between different characteristics of these adhesive materials and suitable curing methods.
Especially in the field of opto-electronically applications the proven solder materials is AuSn (80Au 20Sn) which is used in a flux less process. Layers or bumps of AuSn material located on chip and substrate are soldered together in a temperature and force process.
To attach e.g. laser bars onto sub-mounts, there are several technologies available and Indium solder has proven to be one of the better choices. The important considerations here are to limit the thermal stress to the laser bar and to reduce the oxide film of the indium solder to be as low as possible.
Using eutectic solder as bump materials is a well known technology since IBM introduced their C4 Flip Chip technology years ago. Solder is applied to the chip by ball placements or solder paste is printed to the pads. By using a reflow process the solder is melted and formed to balls.
Using eutectic solder as bump materials is a well known technology since IBM introduced their C4 Flip Chip technology years ago. Solder is applied to the chip by ball placements or solder paste is printed to the pads. By using a reflow process the solder is melted and formed to balls.
After accurate alignment and placement of the chip to the substrate the chip and substrate are heated up to the melting temperature of the interconnect material. Simultaneously force is applied to the chip and controlled during the whole bonding process.
After accurate alignment and placement of the chip to the substrate the chip is activated by ultrasonic power. Supported by force and heat the chip bumps are scabbing on the surface of the substrate pads and create a connection between bumps and pads into a one direction oscillation (about 50 – 60 KHz).
