Especially in the field of opto-electronically applications the proven solder materials is AuSn (80Au 20Sn) which is used in a flux less process.
Layers or bumps of AuSn material located on chip and substrate are soldered together in a temperature and force process. Typical solder temperatures are in the range of 320 C. The bonding forces have to be controlled very precisely during the process.
Application examples:
- Soldering of laser bars to heat sinks
- Soldering of single laser or VCSEL to sub mounts
- Assembly of high brightness LED
- Assembly of electro-optical modules
Recommended FINETECH modules by side the base system:
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