FINEPLACER® Micro AMA
Automatic Micro Assembly
The patented FINETECH platform with vision alignment system (VAS) forms the basis for the automatic rework system. Based on a stationary beam splitter, the reliability of this working principle has been proven at several hundred installations worldwide.
A highly accurate and ”friction-free“ positioning table with x,y planar motor and high resolution z axis control is integrated. An additional fast linear axis enables large substrates to be accommodated, as well as a provision for component storage in trays or waffle paks. Likewise, the FINETECH pivot arm with component rotation capability is automated for handsfree placement.
Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate, providing a complete rework process including the patented ”single-sweep“ residual solder removal technique. All versions of the FINEPLACER® Micro AMA system have a placement accuracy of better than 10 µm, sufficient for highest demands from large Super BGA down to µBGA, CSP and Flip Chip demands. |
