FINEPLACER® Micro MA
Multipurpose Bonding Platform
The FINEPLACER® Micro MA can be used in a wide field of application. The machine shown on the right is a motorized thermo compression die bonder with optional die picking module for wafer frames.
The Micro MA offers high accuracy [10 µm (0.4 mil) placement accuracy], allowing to bond smallest dice with a pitch of down to 50 µm. Compared to the Pico MA, the machine offers an enlarged working space and therefore it can be used with wafers up to 8" diameter, with full access to each die.
Typical fields of application are
- RFID assembly
- Sensor assembly
- Chip on flex
- Embedded components
- LED bonding
- Chip to wafer bonding (8'')
All established micro assembly methods can be executed, such as
- Die attach
- FlipChip bonding
- Soldering (AuSn, Indium)
- Thermocompression
- Ultra-/thermosonic
- C4 soldering
-ACF/ACP/NCP
- Curing
- UV
- Temperature
Apart from those, FINETECH keeps pace with new technical developments, resulting in continuous upgrading of existing features and development of most up to date new process modules.
Benefits:
- Multipurpose platform for micro assembly and rework applications (upgradable for hot gas)
- Patented vision alignment system ensures placement accuracy better than 10 µm
- Large field of view and working area
- Live process observation
- Stable and compact system with minimal number of moving parts
- High resolution vision with fibre optic lighting
- Sophisticated FlipChip bonding software
- Software-controlled processing
- High level of flexibility
- Easy adaptable to various applications
- Designed for pre series production, process & product development
- Optional motorized bonding force module
- Ready for sophisticated future technologies
- Low cost of ownership
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