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FINEPLACER® Pico AMA
Automatic Micro Assembly
FINEPLACER® Pico AMA is an innovative automatic micro assembler that offers users extreme modularity and flexibility. Because the system is based on a modular platform, it offers a high range of flexibility and can be applied to a wide application range. Additionally, the ability to upgrade and retrofit provides significant cost benefits to users - it provides an “all in one” cost-saving solution.
With a high placement accuracy of 5 µm @ 3 σ, the FINEPLACER® Pico AMA is ideal for the advanced placement and bonding of optoelectronic components, MEMS, multichip modules, sensors, RFID assembly, and more. The system is versatile for many bonding techniques, including flip chip (thermocompression, ultrasonic, and soldering), dispensing, UV curing, fluxing and ACP. Picture processing, self-propelled positioning table and placement arm as well as automatic force generation allow the system to bond numerous, like components continuously, resulting in throughput improvement.
The FINEPLACER® Pico AMA is operator independent – providing stability and increased process safety for a production environment. |
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Benefits:
- Patented vision alignment system ensures placement accuracy of 5 µm @ 3 σ
- Fully automatic operation and assembly process
- 100 % operator independent
- Closed loop control of temperature and force
- High level of flexibility due to modular concept
- Easy adaptable for different applications
- Die Pick-Up from blue tape, flipping module
- Precise non-wearing x,y planar table
- Stable and compact system with minimal numbers of moving parts
- Flip Chip Bonding Software with Windows® GUI
- Open data interface structure to assembly line
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Technical Specifications & Optional Modules |
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Technical Specifications |
| Placement Accuracy: |
5 µm @ 3 σ |
| Placement Area: |
280 mm x 115 mm |
| x,y Travel Range: |
380 mm x 155 mm |
| x-Axis Travel Range: |
10 mm |
| Rotation of Placement Head: |
360° |
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Rotation of Tool |
180° | |
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| Application Package for Automatic Laser Bar Bonding | back to top |
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All steps of laser bar assembly can be carried out by the system - including batch recognition, handling and flipping of laser bar, transfer of submount or heatsink, bonding or soldering. The automatic vision aligment system eliminates the operator influence of the bonding result. After alignment and gently placement of the laser bar the controlled Indium and AuSn soldering process starts. The post bond accuracy of the assembled module can be measured by the integrated measurement module. An accuracy significantly better than 5 µm @ 3 σ can be achieved by the system. | |
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Die Flip Module |
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Substrate Handling Module |
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Measurement Module (post bond accuracy)
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| FINEPLACER® Pico AMA - Application Package for RFID | back to top |
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The Pico AMA consistently combines the FINEPLACER®'s high accuracy with automatic pattern recognition, opening the possibility to produce batches of pre series RFID modules with identical or custom modified properties. All steps of the automatic production process are integrated:
- Dispense adhesive on antenna
- Pick up component from wafer
- Flip component
- Place component on transfer station
- Pick up component from transfer station
- Align component to target structure
- Place component on antenna
- Bond component to antenna
The automatic RFID bonder is equipped with wafer picker incl. flipping unit and dispenser. The dispenser works with simple pressure time control. It is able to handle heat curing adhesive, it is easy to clean and provides sufficient dosing precision. |
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- Dispense adhesive on antenna
- Pick up component from wafer
- Flip component
- Place component on transfer station
- Pick up component from transfer station
- Align component to target structure
- Place component on antenna
- Bond component to antenna
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The dispenser works with simple pressure time control. It is able to handle heat curing adhesive, it is easy to clean and provides sufficient dosing precision.
The Pico AMA is further equipped with a vacuum support plate for antenna array, allowing to handle several antennas on one substrate.
The software allows simple repetition as the same alignment procedure can be done at different positions with the need to teach the necessary parameters only once.
The wafer picker makes chip presentation easy. The dice are lifted by needles and picked up by a vacuum tool without affecting neighboured components. |
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The Pico AMA is further equipped with a vacuum support plate for antenna array, allowing to handle several antennas on one substrate.
The software allows simple repetition as the same alignment procedure can be done at different positions with the need to teach the necessary parameters only once.
The wafer picker makes chip presentation easy. The dice are lifted by needles and picked up by a vacuum tool without affecting neighboured components. |
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Click on the PDF icon to load the product flyer for:
FINEPLACER® Pico AMA |
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Click on the PDF icon to load the application note for:
Packaging Technologies of VCSEL |
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| In case your access to our online media service is blocked due to 3rd party file storage restrictions, please use the contact form to get in contact with us and we will send you the desired documents as soon as possible. We apologize for any inconvenience. |
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