FINEPLACER® Pico MA
Multipurpose Bonding Platform
The FINEPLACER® Pico is FINETECH's most versatile base module. It can be used in a wide field of application for reflow/rework (Pico Rework Station) and different kinds of micro assembly, e.g. Flip Chip and Die bonding (Pico Micro Assembly).
On one hand, the Pico MA offers highest accuracy [5 µm (0.2 mil) placement accuracy], allowing bonding of the smallest die with a pitch of down to 50 µm. The machine is capable of reworking all types of SMT components (BGA, QFN, connectors, QFP, SOIC, etc.).
All established reflow and bonding methods can be executed. Moreover, FINETECH keeps pace with new technical developments, resulting in continuous upgrading of existing features and development of most up to date new process modules.
Benefits:
- High placement accuracy < 5 µm
- Patented vision alignment system
- Compact design with minimal numbers of moving parts
- High level of flexibility through modular design
- Fibre optic illumination
- Graphical user interface based on Windows XP
- Designed for process & product development
- Optional semi-automatic configuration
- Ready for sophisticated future technologies
- Low cost of ownership
- Multipurpose platform for micro assembly and rework applications (upgradable for hot gas)
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