An accurate residual solder removal is an essential factor of success for most rework applications. However, increasing packing density and ever shrinking sizes of SMD components make it more and more difficult to get safe access to the workspace. Manual/ mechanical residual solder removals hold the risk of damaging solder resist, contacts or even PCB tracks which could result in a defective board. Thus, only contactless residual solder removal provides a truly safe way.
FINETECH already has been offering contactless solder removal solutions optimized for the specific demands of small and heavily populated sites. The solder balls get reflowed by an appropriate process and afterwards removed by suction, using the solder removal head. Only a single left-to-right sweep is required which reduces the thermal stress to the board to a few seconds. Linear levers for even movement as well as an infrared start sensor allow reproducible processes. Adjacent components and the PCB will be protected reliably from damage.
The approved FINETECH solution is not only reliable but saves your time significantly! Other solder removal solutions in the market require multiple side-to-side sweeps or they circle above the PCB.
Due to strong demand this contactless solder removal procedure now has been adapted to the requirements of the rework of large components. It was necessary to modify the existing solder removal module and to develop special solder removal tools with an increased flow rate.
For the first time presented at the SMT 2008 exhibition, the new "Twin Power" solder removal head with dual chamber system now is the best contactless solder removal choice for large SMD components with 35 mm edge length. Nozzles for even bigger component dimensions can be offered by request.
By providing constant suction power over the whole width of the site and combined with precise heat management, the "Twin Power" solder removal head can quickly and reliably remove liquid solder in a single sweep.
With "Twin Power", FINETECH is the only supplier of a safe and stress reduced solution for contactless solder removal at large SMD sites. See the video at http://www.finetech.de/enid/solderremoval#srvideo. |
