New Soldering Software WinCOMISS 1.5
To coincide with the deadline for the introduction of Lead Free materials, FINETECH has created a new version of their soldering software WinCOMISS. Many new functions have been added, particularly those useful for processing Lead Free materials.
The newly integrated Profile Library offers more than 200 proven soldering profiles. These can be very quickly adjusted to individual boards and components with a Drag & Drop function. Compared to automatically generated profiles, this method ensures significantly more reliability in the rework process. The processes are machine independent and can be transferred to other FINEPLACER® systems with reproducible results.
Process Documentation in the new software has been expanded to improve quality management. All process relevant parameters can be saved and expanded with additional information, such as text remarks, pictures and videos from the process camera (recording can be initiated at any point during the process).
WinCOMISS 1.5 delivers reproducibility at the highest level. The new version allows controlled preheating of the PCB with a profile prior to the soldering process. After heating, fast and controlled cooling leads to noticeably shorter process times.
A significant enhancement in terms of predictability is the new sequential control that visually guides the user through the entire process, step by step. The risk of error is reduced to a minimum.
To keep within the limits set by JEDEC, a Diagram can be overlaid and by setting the appropriate values, the process can be automatically stopped to protect the assembly.
This Windows software is highly valued by customers for its simplicity and extensive functionality. |
