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The entire area of the PCB will be heated by hot gas. The hot air outlet is clamped into the positioning table, and adapts automatically to the PCB size. Type RB11 is used together with the micro controller driven reflow module.
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Technical Specifications |
| PCB Width (min.): |
100 mm |
| Heating Power: |
1600 W at 230V |
| Required Air Flow: |
160 Nl/min at 6 bar |
| Steadiness of Air Temperature: |
± 5% |
| Air Purity |
according to DIN ISO 8573-1, Class 4 | |
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This module is used when defined areas of the PCB are going to be heated preferably. The substrate or PCB will be heated from the underside by hot gas, conveyed by a tube beneath the PCB and directed to the soldering place bottom region. The nozzles are exchangeable against four diffuser sizes. Bottom heater RB7 must be used together with the micro controller driven hot gas reflow module.
This bottom heating is especially suitable for rework of mobile devices (cell phones, PDA's pacemakers, handhelds ...).
| Technical Specifications |
| Max. Air Temperature at nozzle |
360°C |
| Steadiness of Air Temp. at nozzle |
± 3% |
| Required Air Flow |
80 Nl/min at 6 bar |
| Air Purity |
according to DIN ISO 8573-1, Class 4 |
| Heating Power |
900 W |
| Standard Diffuser Nozzle |
12 mm x 12 mm |
| Large Diffuser Nozzle |
100 mm x 100 mm |
| Octagonal Diffuser Nozzle |
56 mm x 56 mm |
| Small Diffuser Nozzle |
50 mm x 100 mm |
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| Designed for extra large PCB sizes and SMD components
The segment bottom heater RB15 provides active heater surface from 190 mm x 95 mm (2" x 4") up to 475 mm x 380 mm (18'' x 15''). The heater is modular designed, the maximum size contains 4 segments (A to D) and is easy adaptable. The working segments are software defined. The complete equipped segment bottom heater is recommended to be used with the FINEPLACER® Jumbo.
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Technical Specifications |
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Segments |
Power |
Dimensions |
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A |
350 W |
190 x 95 mm |
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A+B |
1050 W |
285 x 190 mm |
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A+B+C |
2100 W |
380 x 285 mm |
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A+B+C+D |
3500 W |
475 x 380 mm |
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Steadiness of Air Temp. |
± 5 % |
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Air Purity |
according to DIN ISO 8573-1, Class 4 | |
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The PC controlled Segment Bottom Heating RB 20 is used for even heating of large circuit boards from beneath by means of hot air or inert gas. RB20 provides a segmented heat register, whose exhaust area is 291 mm x 190 mm. The three segments can be activated independently.
The flexible board holder of the positioning table allows clamping of boards with sizes deviating from the heat register's exhaust area.
| Technical Specifications |
| Active Heater Surface |
291 mm x 190 mm |
| Maximum Power Consumption |
2200 W |
| Steadiness of Air Temperature |
± 3 % |
| Air Purity |
according to DIN ISO 8573-1, Class 4 | |
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The new bottom heater RB18 was especially developed for automatic batch rework tasks. Optimized heat distribution for lead-free applications in high density packages. Active heater surface 330 mm x 170 mm.
| Technical Specifications |
| Active Heater Surface |
330 mm x 170 mm |
| Heating Power |
1400 W |
| Steadiness of Air Temperature |
± 3,5% |
| Air Purity |
according to DIN ISO 8573-1, Class 4 | |
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