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Adhesive Conductive Film Module
For bonding dice on glass substrates like LCD, using Chip On Glass (COG) technology, most times the ACF (Anisotropic Conductive Film) process is used. For conducting the chip to the substrate, first a conductive film has to be placed on the display. In many cases this film is not transparent, and thus it does not allow viewing the ITO structures of the display.
To place the components nevertheless with few microns placement error, the system FINEPLACER® has been extended by a new module. It is used to align the ACF cut out to the contact areas, and prebond it on the glass substrate with heat and force. The chip that was already aligned before the ACF prebonding is now pressed onto the ACF. After that, the machine runs the PC controlled bonding process, using defined heat and bonding force. During the process the chips bumps penetrate the ACF and the conductive particles are pressed to one another, creating an electrically conductive joint. The heat input can be supplied via the chip and, if necessary, via the substrate. It cures the adhesive and additionally gives a durable stabile position of the chip.
FINETECH supplies ACF modules for "prebonding after alignment", giving the possibility of using transparent and opaque films as well.
Bonding a chip with ACF cut outs just needs the following main steps:
- Pick up component
- Pick up ACF cut out using FINETECH ACF Module
- Align component's bottom surface structure (bumps/fiducials) to footprint on substrate
- Prebond ACF using FINETECH ACF Module
- Bond component
| During the sequence of chip and ACF aligning and bonding, the heated ACF bonding head has to be moved. It is flipped into the working position during prebonding (see picture 1). During chip alignment and placement it is flipped into the standby position (see picture 2). |
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Technical Specifications |
| Appliance Description |
FG1, ACF Module, PC controlled |
| Voltage |
230 V, 110 V, 100 V; 50 Hz or 60 Hz |
| Max. Power Consumption |
150 W |
| Fuse |
1 A (slow reacting), 250 V |
| Maximum Output Voltage and Power |
24 V, 80 W |
| Maximum Temperature at the tool |
120 °C |
| Temperature Increase |
about 3 K/s |
| Air Input |
6 bar, tolerance: +1 bar, -0.5 bar |
| Air Consumption |
53 standard liters per minute at 6 bar |
| Air Purity |
Particles, water and oil content according to DIN ISO 8573-1, Class 4 |
| Surrounding Temperature |
15 °C ... 40 °C |
| Dimensions of Control Box |
310 mm x 290 mm x 155 mm |
| Weight of Control box |
about 7.9 kg | |
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