BGA Reballing Module

The BGA Reballing Module allows solder balls to be restored on custom specified BGA or CSP components after residual solder has been removed. It is used together with a hot gas bottom heating module, as well as the top heating module COMISS.

The reballing nozzle is then clamped into the reflow arm and the template bores are filled with balls. Moving the air cushion table, the template is aligned to the nozzle, just as for soldering. Using COMISS with a special BGA reballing temperature profile, the balls are connected to the component's pads. For hard balls, a solder paste printing template is needed.

The component is placed face down in the BGA reballing frame, and the reballing template is manually aligned to the pads.

FINEPLACER^® Pico RS (modular rework system for smallest components and mobile devices)
FINEPLACER^® Micro RS (modular rework system for advanced and standard rework)
FINEPLACER^® Micro HVR (automatic rework station for advanced and standard rework)
FINEPLACER^® CRS (compact rework system for advanced and standard rework)
FINEPLACER^® Jumbo (modular rework system for very large board sizes)
FINEPLACER^® Jumbo HVR (automatic rework station for very large board sizes and standard rework applications)

^{*the configuration shown on the picture may contain optional modules}