| FINEPLACER® FEMTO to Make its Asian Premiere at the SEMICON 2007 Show
The FINEPLACER® FEMTO is the new member of the awarded FINEPLACER® family - an automated bonding platform capable of handling complex high-precision applications in the fields of micro- and opto-assembly.
The FEMTO provides an outstanding performance in steadiness and precision besides well-known and familiar flexibility through its modular design. The automated system eliminates operator interaction and secures process repeatability.
New features include an remarkably enlarged working area as well as automatic pattern recognition and alignment, based on motorized X, Y, Z and theta movements.
With its open system architecture, FINEPLACER® FEMTO can be easily adapted with specific optional modules to which allow an outstanding multitude of applications and processes. The spectrum ranges from power laser and laser bar bonding, flip chip and VCSEL bonding over assembly of MEMs and MOEMs, sensors or micro-optics to chip on glass or surface mount photonics.
FINEPLACER® FEMTO has been designed for production environments as well as for product & process development and never fails to impress with extraordinary low costs of ownership. Combining high accuracy (± 0.5 µm) and process flexibility with arguably the smallest footprint (1270 x 990 mm) in the market, the FEMTO is predestined for cleanroom applications.
FINETECH will exhibit the new FEMTO in OPTO-BONDER® configuration at the “SEMICON 2007” (booth no. 2166) in Shanghai, China.
More information available at www.opto-bonder.com |
