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FINEPLACER® Pico RS (modular rework system for smallest components and mobile devices) FINEPLACER® Micro RS (modular rework system for advanced and standard rework) FINEPLACER® Micro HVR (automatic rework station for advanced and standard rework) FINEPLACER® CRS (compact rework system for advanced and standard rework) FINEPLACER® Jumbo (modular rework system for very large board sizes) FINEPLACER® Jumbo HVR (automatic rework station for very large board sizes and standard rework applications) *the configuration shown on the picture may contain optional modules
01005 components become more and more important these days. Rework of such small components are very challenging, a manual rework with solder iron is plainly impossible. Get information about this application and see short videos.
If the ball(s) that is being reworked is located in the center of the BGA package, it becomes difficult for an operator to use the older, standard approach of solder wick and a soldering iron to remove the deformed ball. As with the soldering profile, the solder removal process must also be established so as not to disturb the neighboring solder balls that already pass testing.
The PoP soldering head is an easy-to-use tool for reworking stacked devices as a whole in a single reflow process. It uses vacuum-actuated mechanical clamping tweezers which avoid separating the single layers of a PoP during component removal. The PoP soldering head can be easily adapted to different component thicknesses. Furthermore it is possible to adjust the width of the clamping tweezers prior to the process when the rework arm is swiveled down to avoid affecting other components on the PCB (e.g. accidental shifting of neighboring small passives).
Progressively, the industry is looking to and implementing smaller components. Micro-leadframe (MLF) components, such as QFNs, are being incorporated into area-sensitive products - with contact pads attached directly to the bodies using leadframe technology (Figure 1). These components enable higher PCB densities.
