| The future belongs to ever smaller components. Increasingly SMDs of the types QFN, MLF are used with contact areas directly attached to their bodies. Contact leads are not used at all to achieve, amongst others, higher component density on printed circuits boards.
Reliable rework of MLF, QFN components demands higher standards of the equipment and the technology used.
The increased contact areas enhance heat flow from components to PCBs and require greater attention when establishing heating profiles and choosing rework tooling.
Leadless components do not provide any solder coating so that new solder paste needs to be applied. This can be done conventionally by partial printing of solder paste unto the PCB, although the high component density often allows little or no space and requires very skilled operators or a better technology.
The newly developed “Direct Component Printing Module“ (DCP Module) achieves an “All in One“ solution for reworking QFN and MLF components. Besides component and residual solder removal and soldering of the new components, the DCP Module applies new solder directly onto the components within the FINEPLACER® rework station.
Using the FINEPLACER® the contacts of the components are aligned very precisely to the stencil in the DCP Module. Tolerances in the component bodies are compensated for and paste can be applied even to the smallest pitches. After placing a component into the DCP Module new solder paste is applied. Without intervention by the operator the component is then transferred to the Reflow Arm. This is followed by the standard high precision alignment of component and board using the Vision Alignment System and component placement.
The DCP Module can be added to existing FINEPLACER® systems by simply attaching it to the side of the positioning table. Thus FINETECH provide a simple to use and reproducible method for the rework of leadless components. |
