Rework Applications:

PoP / BGA Rework Get more information about hot gas rework technology for Package on Package or BGA components.

Small Passives Approved solutions for rework of Small Passives (01005, 0201, 0402...).

QFN Rework Read more about our "All in One" rework solution for QFN and MLF components.

Overview Rework Equipment

Video Microscope Workstation

Opto Bonding & Micro Assembly:

Laser Bar Bonding Read more about our solutions for bonding of laser bars / single lasers.

FlipChip Bonding  Learn more about FlipChip bonding, RFID Assembly and the high precision FINEPLACER® platform.

RFID Assembly Get more information about this new application for the FINEPLACER® systems, used for R&D and pre-series RFID production.

Overview Flip Chip Bonder Equipment

Automatic Sub-Micron Flip Chip Bonder

Company Profile

Take 3 minutes to learn more about FINETECH flip chip bonder and rework equipment.

Trade Shows

Jan 27 - 29, 2009 Photonics West 2009 San Jose, CA  Mar 17 - 19, 2009 Semicon China 2009 Shanghai, China Mar 31 - Apr 2, 2009 APEX 2009 Las Vegas, NV Apr 13 - 16, 2009 ExpoElectronica Moscow, Russia  Apr 21 - Apr 24, 2009 Nepcon/EMT 2009 Shanghai, China

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