Bonding of Single LaserThe most popular technology of bonding of single laser or laser bars is soldering using AuSn as interconnect. The bottom of the die and the top of the sub mount are typically equipped with a AuSn layer. Within a bonding process (temperature and force) the chip is soldered to the sub mount.
Mainly requested beside excellent soldering quality and uniformity is the placement accuracy as well as post bonding accuracy in small micrometer range. Typically a placement accuracy of 1 micron for single laser and better than 3 microns for laser bars are requested.
Recommended machine configuration to full fill the single laser bonding applications - FINEPLACER® Lambda with the following modules :
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