• Accuracy Meets Automation

  • The Femto Bonder

    Automated sub-micron bonder with precise placement.

  • Manual Override

    Automated die bonder with simple single-part prototyping

  • Yield!

    It's not how many you make,
    it's how many work!

  • All-In-One System

    Different technologies. Same machine.
    Modularity for R&D bonding.

  • Built for You

    Systems that focus on your specs, your goals!

  • Collaborate with Us

    You have the idea. We have the technology.
    Together we have the solution!

Sub-Micron Equipment for Advanced Technologies

BONDERS for high accuracy, advanced packaging and micro assembly of photonic devices, flip chip, C2W, copper pillar, sensors, MEMs ... learn more

REWORK systems with proven thermal management for today's challenging applications: stacked die, QFN, flip chip, small passives, reballing ... learn more

COLLABORATE with our engineers on your unique bonding and assembly needs, and we’ll deliver the ideal equipment solution built for you ... learn more

Product Highlights

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Finetech has developed a high force version of the versatile FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

The tool achieves applied bonding forces of up to 700 N, which is critical to ensuring coherent and durable bonds between the chip and ACF to achieve higher signal densities and smaller overall packages. Polymer-based ACF is used to create an
electro-mechanical connection between two components.

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Bonding Blog

Aligning a 4-channel VCSEL and a 4-channel photo diode on a PCB (using conductive epoxy) is challenging.  Two recommended approaches...

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