Semi-automated Die Bonder

    0.5 µm  |  300 mm  |  1000 N

  • FINEPLACER femto 2

    Automatic Sub-micron Bonder

    for ultra precision flip chip and die attach

  • FINEPLACER lambda

    Sub-micron Opto Bonder

    Outstanding optical resolution and instant operation


Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation or applications requiring extra reliable and stable connections.

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Product Highlights

The sub-micron accuracy Lambda die bonder will be in our booth #612 at the IMAPS Symposium in Pasadena, California.  Stop by to learn how this flexible system is ideal for precision bonding for many applications including flip chip, photonics, MEMs, sensors, micro LEDs, 3D, chip-on-flex ... IMAPS Pasadena is the largest program for Microelectronics, Advanced Packaging, 2.5/3D, Emerging Applications & Materials this fall.

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Bonding Blog

One of the best things about working at Finetech is we get to see some really incredible...

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