Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.
Bonding system installed at MiQro Innovation Collaborative Centre (Advanced Packaging sector) in Canada
Back in 2000, Semtech Corporation purchased a FINEPLACER® pico rework system – one of the first systems sold by the newly formed USA sales office of Berlin-based Finetech GmbH. ...
A FINEPLACER® pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Intel® Corporation has recognized Finetech with an Appreciation Award presented by Intel’s Equipment Vendor Enabling program.
The bonding and packaging of laser bars, VCSELs, photo diodes, LEDs, sensors, and detectors requires high accuracy, superior optics, and process flexibility ….
Mobile device rework involves repairing densely populated boards with constricted space. Avoid disturbing neighboring components and the shifting of already placed package levels…