• Sub-Micron Accuracy

    Sub-Micron Accuracy

    2.5D / 3D IC packaging and Multi-Chip Modules

  • 300 mm Wafer Capability

    300 mm Wafer Capability

    High-precision wafer level bonding

  • 1000 N High Force Bonding

    1000 N High Force Bonding

    High I/O count, ACF and sintering applications

  • FPXVision™ Alignment Optics

    FPXvision™ Alignment Optics

    Always maximum resolution and alignment assistance


Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation or applications requiring extra reliable and stable connections.

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Product Highlights

Lambda Die Bonder

The FINEPLACER® lambda die bonder is ideal for the advanced packaging of photonic devices and handles a wide range of applications: laser bar bonding with Indium or Au/Sn (with forming gas or formic acid), bonding of VCSEL/photo diodes, Si photonics, sensors, PICs and LED assembly, as well as an integrated dispense. Visit us at Photonics West, Feb. 16-18 in San Francisco.

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Bonding Blog

The variety of imaging sensors requires diversity in bonding and assembly technologies…

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