Sub-micron Opto Bonder

    Outstanding optical resolution and instant operation

  • FINEPLACER femto 2

    Automatic Sub-micron Bonder

    for ultra precision flip chip and die attach


Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation or applications requiring extra reliable and stable connections.

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Product Highlights

Photonic and optoelectronic device applications demand the highest optical resolution to achieve strict placement accuracy requirements.  Our sub-micron accuracy bonders provide superior optics and process flexibility to handle laser diodes, VCSELs, silicon photonics, LEDs, laser bars, sensors and detectors.

Come see a demo on our motorized Lambda system at Photonics West in San Francisco Jan. 31 - Feb.1.

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Bonding Blog

It's great to see our customers move from prototype and development bonding to production level bonding.

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