• Accuracy Meets Automation

  • The Femto Bonder

    Automated sub-micron bonder with precise placement.

  • Manual Override

    Automated die bonder with simple single-part prototyping

  • Yield!

    It's not how many you make,
    it's how many work!

  • All-In-One System

    Different technologies. Same machine.
    Modularity for R&D bonding.

  • Built for You

    Systems that focus on your specs, your goals!

  • Collaborate with Us

    You have the idea. We have the technology.
    Together we have the solution!

Sub-Micron Equipment for Advanced Technologies

BONDERS for high accuracy, advanced packaging and micro assembly of photonic devices, flip chip, C2W, copper pillar, sensors, MEMs ... learn more

REWORK systems with proven thermal management for today's challenging applications: stacked die, QFN, flip chip, small passives, reballing ... learn more

COLLABORATE with our engineers on your unique bonding and assembly needs, and we’ll deliver the ideal equipment solution built for you ... learn more

Product Highlights

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The FINEPLACER® Lambda is the ideal choice for low volume production, prototyping, universities and R&D environments where process flexibility is the key.

Used for high accuracy die attach and component placement in advanced packaging,
this cost-effective die bonder handles a wide range of sophisticated processes, including Indium and eutectic bonding, and extremely sensitive materials such as
GaAs or GaP.  The all-in-one bonder - in manual and motorized configurations. 

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Bonding Blog

Anosotropic Conductive Film and Paste use tiny polymer spheres coated with gold to make an electrical connection between die and substrate.  The bonding processes vary...

Learn more                     Blog Overview

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