• Sub-Micron Accuracy

    Sub-Micron Accuracy

    2.5D / 3D IC packaging and Multi-Chip Modules

  • 300 mm Wafer Capability

    300 mm Wafer Capability

    High-precision wafer level bonding

  • 1000 N High Force Bonding

    1000 N High Force Bonding

    High I/O count, ACF and sintering applications

  • FPXVision™ Alignment Optics

    FPXvision™ Alignment Optics

    Always maximum resolution and alignment assistance

FPXvision - New Alignment System

FPXvisionTM is the newest generation of Finetechs Vision Alignment Systems (VAS). Going beyond an ordinary evolution, this impressive range of technological innovations opens up new fields of application to the user.

With FPXvisionTM Finetech takes FINEPLACER® optics to the next level.

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Product Highlights

bga rework station

The FINEPLACER® coreplus meets the needs of single system / high-mix rework, or multiple system production environments where process portability and reproducibility are crucial.  The complete rework cycle is handled in one efficient design using precise temperature and gas flow control of convection top and bottom heating. Check out our video to see how easy the system is to operate.

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Bonding Blog

So why has our newest family member, the FINEPLACER® sigma, shaken things up?  Finetech has developed...

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