Semi-automated Die Bonder

    0.5 µm  |  300 mm  |  1000 N

  • FINEPLACER femto 2

    Automatic Sub-micron Bonder

    for ultra precision flip chip and die attach

  • FINEPLACER lambda

    Sub-micron Opto Bonder

    Outstanding optical resolution and instant operation


Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation or applications requiring extra reliable and stable connections.

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Product Highlights

The semi-automated, high-accuracy FINEPLACER® sigma die bonder is now in Finetech’s Manchester, New Hampshire lab and available for customer specific demonstrations.  The sigma features sub-micron placement accuracy, bonding forces to 1000 N, die size up to 100x100mm, and high resolution for all magnifications. We invite you to contact us to schedule a demonstration.

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Bonding Blog

One of the best things about working at Finetech is we get to see some really incredible...

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