• FINEPLACER femto 2

    Automatic Sub-micron Bonder

    for ultra precision flip chip and die attach

  • FINEPLACER lambda

    Sub-micron Opto Bonder

    Outstanding optical resolution and instant operation

PRECISION VACUUM DIE BONDING

Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation or applications requiring extra reliable and stable connections.

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Product Highlights

The Mini-Oven 05 is a compact and versatile IR reflow oven suitable for a wide range of SMD components.  This cost-effective solution features optimal heat distribution, integrated nitrogen support, profile library, and an external thermocouple.

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Bonding Blog

Active alignment in the context of optical device packaging and silicon photonics packaging...

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