• FINEPLACER femto 2

    Automatic Sub-micron Bonder

    for ultra precision flip chip and die attach

  • FINEPLACER lambda

    Sub-micron Opto Bonder

    Outstanding optical resolution and instant operation


Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation or applications requiring extra reliable and stable connections.

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Product Highlights

The Lambda die bonder is the ideal choice for prototyping, R&D and low volume production environments where flexibility is the key.  Used for high accuracy die attach and component placement, this cost-effective bonder handles a wide range of technologies, including thermocompression / thermosonic bonding, adhesive materials, and mechanical or optical assembly.  Lambda demos at Semicon West booth 6470.

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Bonding Blog

Active alignment in the context of optical device packaging and silicon photonics packaging...

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