Substrate Heating Module

Substrate Heating Modules are designed to be used with thermocompression, thermosonic, curing or soldering processes.  

Different types of substrate heating modules are available which differ e.g. in dimensions of heated area, power, ramp up speed, holder for waffle pak or gel pak.

Additional process gas modules are available for bonding under controlled atmosphere e.g. to avoid oxidation of alloy AuSn or for reduction of solder material like Indium.

  • Substrate heating module

Highlights*

  • Temperature controlled profile (heating/cooling)
  • Even heat distribution
  • Thermaly compensated heating area
  • Special coated surface
  • Vacuum substrate/tray holder
  • Customized vacuum interposers for odd substrate surfaces
  • Support for process gas (N2/N2H2/formic acid)
  • Add-on Process Gas Module
  • Add-on Formic Acid Module

* depending on system and configuration

Available for FINEPLACER® femto

Substrate Heating Module - 20 x 20 mm²

Power:250 W
Heated area20 x 20 mm²
Temperature (max):400 °C
Temperature steadiness:+/-2%
Temperature ramps (max):20 K/s
Standard load:20 N
Sales code:FA10.F

Substrate Heating Module - 50 x 50 mm²

Power:1000 W
Heated area50 x 50 mm²
Temperature (max):400 °C
Temperature steadiness:+/-2%
Temperature ramps (max):20 K/s
Standard load / Reinforced load:20 N / 500 N
Sales code:FA7.F

Substrate Heating Module - 100 x 100 mm²

Power:1200 W
Heated area100 x 100 mm²
Temperature (max):400 °C
Temperature steadiness:+/-2%
Temperature ramps (max):3 K/s
Standard load / Reinforced load:100 N / 500 N
Sales code:FA9.F

Substrate Heating Module - Wafer Chuck

Power:tbd.
Heated area6'' to 12''
Temperature (max):300 °C
Temperature steadiness:+/-1% or better
Temperature ramps (max):10 K/s
Standard load / Reinforced load:30 N / 200 N
Sales code:tbd.

*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.

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