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  • Robert Avila
    Finetech - USA/West
    Phone:
    +1 480 893 1630
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FINEPLACER® matrix ma

Semi-automatic Die Bonder

The FINEPLACER® matrix ma is a semi-automatic bonder representing the latest development from Finetech. Encompassing the “Built to be Best” philosophy, this system points the way forward for the Finetech product family.

Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment.

Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.

  • Die bonder FINEPLACER® matrix ma
  • Flash is required!

Highlights

  • Placement accuracy 3 µm*
  • Components from 0.1 mm x 0.1 mm to 150 mm x 150 mm*
  • Substrate sizes up to 350 mm x 350 mm*
  • Supports wafer sizes up to 12" *
  • Closed loop force control
  • Real time contrast optimization with LED lighting
  • Low maintenance, easy service access as a design priority
  • Fast conversion from die bonder to rework station*

* depending on configuration and application

Features

  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Process transfer from system to system
  • Virtually unlimited range of advanced bonding technologies 

Benefits

  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
  • Immediate visual feedback reduces process development time
  • Process transfer from R&D to production saves time, guarantees reliable results
  • ROI savings - one machine for all applications

Technologies

Applications

Technical Specifications

Placement accuracy:3 µm
Field of view (min)1:1.2 mm x 0.9 mm
Field of view (max)1:15.7 mm x 11.9 mm
Component size (min)1:0.1 mm x 0.1 mm
Component size (max)1:100 mm x 100 mm
Theta fine travel:± 2°
Z-travel10 mm
Working area1:310 mm x 197 mm
Bonding force (max)2*:500 N
Heating temperature (max)1,2*:400 °C

* depending on configuration/application
1 standard value, other values on request
2 optional module