Rework of BGA / CSP
BGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but also to the broader SMT Rework market. Large sphere arrays (BGA), and small fine pitch arrays (CSP) demand configurations that combine precise thermal management and high resolution optics, to ensure a void-free rework process and accurate alignment.
What are the Challenges?
- One system for the complete rework cycle - from component removal to re-soldering?
- Large arrays (20-65 mm) need large optical field of view, whereas smaller fine pitch CSP's (0,8-20 mm) need high magnification (both require good resolution)
- Solder removal of irregular shaped residual
- Need to remove the BGA, but leave the neighboring devices undisturbed?!
- Want instant profiling?
- Multilayer board sizes from USB stick (12x40 mm) to server board (500x465 mm)?















