FINEPLACER® Rework Systems - Overview
FINEPLACER ® rework systems provide solutions for all types of advanced rework applications - BGA, 01005, stacked die, PoP, QFN, flip chip, RF shields, underfill, small passives, reballing, and more.
The complete rework cycle can be accommodated: component removal, residual solder removal, site dressing, complement placement, and BGA reballing.
FINEPLACER® coreplus
Industry-leading, cost-effective rework
- Proven rework technology where process repeatiblity is crucial
- The latest hot air rework system by Finetech
FINEPLACER® pico rs
High density rework station
- Rework in high density environments
FINEPLACER® jumbo rs
Large area rework station
- Board sizes to 750 mm x 500 mm
FINEPLACER® micro hvr
High-volume rework station
- Board sizes to 350 mm x 260 mm