CPU/GPU Rework

SMD components are getting smaller and more complex, with extreme package densities and increased I/O counts. At the same time, they are supposed to shine with ever more functionalities and boosted performance. A trend which makes no exception when it comes to ball grid arrays (BGA), such as processor units (CPU) or graphics chips (GPU). With solder sphere sizes and pitch shrinking and thermal characteristics becoming more challenging, a reliable rework solutions should incorporate high accuracy and perfect heat management.