Die Bonder & Flip Chip Bonder and SMD Rework

FINEPLACER^® pico 2

The Most Powerful Tool for Lab & Research

Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework.
We provide solutions for each stage of your journey - from R&D to industrial automated production.

Research & Development

Our R&D Bonders are ready to tackle the challenges of today and tomorrow. Flexible, accurate and retrofittable at all times.

Unrivaled Flexibility for Prototyping & Production

High Yield Production

Easy process transition from development into production for your ideas in series.

Advanced Rework

Made for all SMD rework challenges. For reworked components as reliable as new.

Latest News

Mar 30, 2023

Finetech announces FINEPLACER^® sigma purchase by long-established customer, Promex

Jun 09, 2022

30 Years „Bringing Visions to Life“

Oct 18, 2021

From concept to final product with the FINEPLACER^® pico 2 bonder

Blog

Oct 29, 2020

// Can You See Me Now? It’s Demo Time

May 18, 2020

// Perseverance through COVID-19

Nov 04, 2019

// Speed vs Throughput

May 09, 2019

// Technology in Bio-Medical Applications

Find Your Local Sales Contact