Die Bonder & Flip Chip Bonder and SMD Rework

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Learn more about our new solution for photonics manufacturing

Finetech is the leading equipment manufacturer for sub-micron die bonding and advanced SMD rework.
We provide solutions for each stage of your journey - from R&D to industrial automated production.

Research & Development

Our R&D Bonders are ready to tackle the challenges of today and tomorrow. Flexible, accurate and retrofittable at all times.

Unrivaled Flexibility for Prototyping & Production

High Yield Production

Easy process transition from development into production for your ideas in series.

Advanced Rework

Made for all SMD rework challenges. For reworked components as reliable as new.

Latest News

Mar 12, 2021

Customer Story: Prototype-to-Production Assembly of Innovative Radiation Detection Products

Feb 05, 2021

Diverse and reliable assembly processes in development and production

Jan 19, 2021

Customer Story: Die Bonder for the Stacking of Membrane Chips with One Micron Post-bond Accuracy

Blog

Oct 29, 2020

// Can You See Me Now? It’s Demo Time

May 18, 2020

// Perseverance through COVID-19

Nov 04, 2019

// Speed vs Throughput

May 09, 2019

// Technology in Bio-Medical Applications

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