Die Bonder for the Stacking of Membrane Chips with One Micron Post-bond Accuracy
The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer.
The Core of Highly Flexible Rework
Siemens AG in Fürth, Germany, successfully uses the hot air rework system FINEPLACER® coreplus for rework tasks in the production of electronics for industrial applications.
Reworking Photodiode Arrays in the Manufacturing Process
How Finetech, together with First Sensor AG, developed a complete solution for reproducible rework of faulty photodiode arrays for CT detectors.
Brain Implant Gives New Hope to Epileptics
The British CANDO project develops brain implants for epileptics which could actively avoid life-threatening seizures. Measuring only few micrometers, the implants are assembled with a FINEPLACER® high-precision die bonder.
Top-tier Equipment for Top-tier Research
Finetech’s versatile flip-chip die bonder is contributing to optoelectronics research at the UK’s top engineering university.
Everything at a Glance
Finetech ensures information flows right on time: Aditech’s modern LCD Displays for transportation and industrial applications are manufactured on multiple automated FINEPLACER® die bonders.
Qualified Rework of Challenging SMD Assemblies
EMS provider Mair Elektronik relies on FINEPLACER® systems for the rework of high-speed camera systems and other high-quality SMD assemblies.