Laser Bar Bonding
Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are...
Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.
Multi Emitter Module Assembly
In order to reduce second-level packaging costs for optoelectronics manufacturing, Finetech has evaluated and is now offering an automatic solution for the packaging of CoS onto a heat sink via reactive multilayer systems (RMS).
Optical Package Assembly
Optical packages are assemblies comprising optical and electronic components. Applications can be found e.g. in communication technologies where optical signals are transformed into electrical signals and vice versa.
Focal Plane Array / IR Sensor Assembly
A Focal Plane Array (FPA) is a sensor with a two-dimensional detector pixel matrix, i.e. for infra-red light or X-rays, positioned in the focal plane of an optical system.
Between two bond partners, adhesive materials can be applied in various ways: dispensing, stencil printing, pin transfer or as a film working as an intermediate connection.
Bonding with Anisotropic Adhesive
In modern displays, Flex-on-glass and Chip-on-Glass are preferred bonding technologies. This goes along with using anisotropic conductive foils or pastes which have a fundamentally different functional principle compared to common adhesives or solder materials.
Bonding Technologies for 3D Integration
An overview about different interconnects used during the system evaluation of the FINEPLACER® sigma.