Laser Bar Bonding
Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are ...
Thermocompression bonding is a quick and easy method to reliably connect flip-chips. As the name suggests, this connecting method relies on force and temperature.
Optical Package Assembly
Optical packages are assemblies comprising optical and electronic components. Applications can be found e.g. in communication technologies where optical signals are transformed into electrical signals and vice versa.
RFID chips (Radio Frequency Identification) are increasingly used in industrial and consumer products. They come in sizes from several millimeters down to a few microns, with very thin and flexible substrates prone to thermal stress.
Between two bond partners, adhesive materials can be applied in various ways: dispensing, stencil printing, pin transfer or as a film working as an intermediate connection.
Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.