Automated High Power Laser Diode Assembly
High power laser diode assembly is a mass production process. An automated laser diode bonder is expected to output complete assemblies at a high unit/hour rate, while maintaining high accuracy and high repeatability for maximum yield over a large variation in component size, and type.
Finetech's "Prototype-to-Production" approach enables fast, creative and flexible product development and seamless process transfer from R&D to production, saving you time and minimizing technological and financial risks.
Laser Bar Bonding
Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
Optical Package Assembly
Optical packages are assemblies comprising optical and electronic components. Applications can be found e.g. in communication technologies where optical signals are transformed into electrical signals and vice versa.
Eutectic Bonding with Au/Sn
Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.
Multi Emitter Module Assembly
In order to reduce second-level packaging costs for optoelectronics manufacturing, Finetech has evaluated and is now offering an automatic solution for the packaging of CoS onto a heat sink via reactive multilayer systems (RMS).
Laser Assisted Die Bonding
Finetech's laser-assisted bonding technology is used in C2S and C2W applications with high demands regarding speed, highest accuracy and localized heat input.
Thermocompression bonding is a quick and easy method to reliably connect flip-chips. As the name suggests, this connecting method relies on force and temperature.
RFID chips (Radio Frequency Identification) are increasingly used in industrial and consumer products. They come in sizes from several millimeters down to a few microns, with very thin and flexible substrates prone to thermal stress.
Between two bond partners, adhesive materials can be applied in various ways: dispensing, stencil printing, pin transfer or as a film working as an intermediate connection.
Bonding Technologies for 3D Integration
An overview about different interconnects used during the system evaluation of the FINEPLACER® sigma.