Rework of 01005 and 008004 Small Passives
008004 and 01005 small passive components are becoming more and more important these days (integration, miniaturization etc.). They allow particularly flat package designs when developing ultra-mobile electronic products such as functional modules,...
Rework of Mini-LED Arrays
Finetech rework systems for R&D and production environments are well suitable for miniature LED rework, such as those in form of SMD LED components (RGB) built into modern display systems.
Rework of Shielded SMD
As the PCB market continues to be in high demand, the RF shield design will remain a challenge to rework. Simply put, the RF shield serves one goal – to minimize the Radio Frequency (RF) noise which can...
Residual Solder Removal
An accurate residual solder removal is an essential factor of success for most rework applications. Finetech offers contactless removal solutions for virtually all SMD components in the market.
Package on Package Rework (PoP)
Package-on-package (PoP) is an electronic circuit consisting of superposed, electrically connected assemblies. The lower module, which is the logic component, is commonly called bottom package, on top of which usually the top package module is situated.
Rework on Flex Materials
Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and are capable of high speed interconnections between
Rework of BGA/CSP and CPU/GPU SMD
The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics.
Flip Chip Rework
Flip chip components have rarely been used in PCB assembly, but they are becoming more and more important as the need for miniaturization of electronic assemblies is growing.
Rework of QFN/MLF
Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics (for example resulting in much shorter reaction times) are being increasingly incorporated into...
Single Ball Reballing
One defect solder ball is enough to render the complete BGA package unusable. The capability to replace single solder balls allows to save particularly valuable or legacy packages.
Rework of Underfilled SMD
Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in...