Technical Papers - Rework

Our technical papers provide in-depth insights into numerous challenges of today's applications, technologies and processes and introduce you to proven solutions by Finetech.

Checklist: Which rework system fits your requirement profile?

This checklist helps you selecting a professional SMD rework system that suits your individual requirements.

Rework of 01005 and 008004 Small Passives

008004 and 01005 small passive components are becoming more and more important these days (integration, miniaturization etc.). They allow particularly flat package designs when developing ultra-mobile electronic products such as functional modules,...

Rework of Mini-LED Arrays

Finetech rework systems for R&D and production environments are well suitable for miniature LED rework, such as those in form of SMD LED components (RGB) built into modern display systems.

Array Reballing

Precise placement of a new solder ball array is called array reballing. This repair process is applied when saving valuable resources (and money) is crucial or when the value chain has to be extended.

Rework of Shielded SMD

As the PCB market continues to be in high demand, the RF shield design will remain a challenge to rework. Simply put, the RF shield serves one goal – to minimize the Radio Frequency (RF) noise which can...

Residual Solder Removal

An accurate residual solder removal is an essential factor of success for most rework applications. Finetech offers contactless removal solutions for virtually all SMD components in the market.

Applying Solder Paste

Finetech offers a variety of equipment solutions for suitable solder paste application during the rework cycle.

Package on Package Rework (PoP)

Package-on-package (PoP) is an electronic circuit consisting of superposed, electrically connected assemblies. The lower module, which is the logic component, is commonly called bottom package, on top of which usually the top package module is situated.

Rework on Flex Materials

Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and are capable of high speed interconnections between

Rework of BGA/CSP and CPU/GPU SMD

The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics.

Flip Chip Rework

Flip chip components have rarely been used in PCB assembly, but they are becoming more and more important as the need for miniaturization of electronic assemblies is growing.

Rework of QFN/MLF

Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics (for example resulting in much shorter reaction times) are being increasingly incorporated into...

Rework of SMD Connectors

Due to their reduced space requirements, miniaturized SMD connectors are increasingly being used for small component assemblies, for example, found in mobile devices. Large SMD connectors and plugs are also widely spread.

Single Ball Reballing

One defect solder ball is enough to render the complete BGA package unusable. The capability to replace single solder balls allows to save particularly valuable or legacy packages.

Rework of Underfilled SMD

Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in...