Package on Package Rework

Author: Dan Lilie

Abstract: Package-on-package (PoP) is an electronic circuit consisting of superposed, electrically connected assemblies. The lower module, which is the logic component, is commonly called bottom package, on top of which usually the top package module is situated, the memory module. However, more than two packages can be stacked or vertically combined. Due to the increasing packing density, PoP solutions are found particularly often in communications technology (e.g. mobile devices). Rework of such 3D-packages requires not only the certain combination of top and bottom heating (thermal management), but also a special solder head design in order to pick individual packages up in one work step.


Document currently not available

We're on it. The document will be available soon. For urgent questions, get in touch with us today.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)