Rework of flex boards

Rework on Flex Material

Author: Dan Lilie

Abstract: Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and are capable of high speed interconnections between different circuit layers. In portable applications, maximum miniaturization can be achieved by folding the PCB. Typical applications are found in medical devices (hearing aids, insulin pumps, neurostimulator implants), consumer electronics (mobile phones, portable computers, cameras, TFT displays) or automotive systems (sensor modules, engine control units). Chip (or Die) on Flex rework is essentially a material handling issue. Thermal profiles reflect the lower substrate thermal mass as compared to a PCB - typically shorter duration and lower air temperatures to reach liquidus. Support of the flex circuit necessitates alternate vacuum clamping systems and the use of conductive, rather than convective, lower heating.

Document currently not available

We're on it. The document will be available soon. For urgent questions, get in touch with us today.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)