FINEPLACER® pico 2 - Multi-Purpose Manual Die Bonder for R&D and Lab
The FINEPLACER® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, the system is ideal for fast and flexible product development and prototyping in R&D labs and universities.
FINEPLACER® femtoblu - Chip-on-Submount (CoS) Assembly
The FINEPLACER® femtoblu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability for photonic applications. This video shows the assembly of edge-emitting laser diodes to AlN submounts.
New FINEPLACER® lambda 2 product introduction
The all-new FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.
Face Down VCSEL Assembly on Transceiver Modules
Thermo-compression bonding process for VCSEL to transceiver substrate assembly. Precise placement is achieved by aligning the VCSEL eye to the substrate aperture.
FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder
The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.
FINEPLACER® femto 2 - Tacking, Bump Bonding
Population of a sensor substrate with several readout chips. Integrated oven process for preparation (bump forming with formic acid) and connection of the fine-pitch bump arrays via tack bonding (indium). Followed by a global reflow process in inert atmosphere.
FINEPLACER® femto 2 - Handling & Dispensing Module
Multilevel chip placement application with 5 micron accuracy and auto alignment. Sorting and assistance processes can also be supported. The handling module picks up die with controlled force, rotates and places the device. The dispenser module allows the application of glue and paste.
FINEPLACER® femto 2 - 3D Joystick
The 3D joystick allows fast, easy machine operation - a helpful tool when combined with the vision system and measuring function. Switching over from automatic to manual mode is possible at any time. Perfect bonding results with no programming effort.
Au-Au Thermosonic Flip Chip Bonding
Au on Au bonding process combines low temperature heat and moderate force aided by ultrasonic motion in the 60 - 100 kHz range - suitable for low to medium I/O count devices. Finetech systems provide optimized field of view for alignment and visual inspection in-situ.