Face Down VCSEL Assembly on Transceiver Modules
Thermo-compression bonding process for VCSEL to transceiver substrate assembly. Precise placement is achieved by aligning the VCSEL eye to the substrate aperture.
Face-up Assembly of VCSEL and PD
Bonding of VSCEL and Photo Diode using a sophisticated reference tool. Process involves vision control of placement. Silver epoxy and curing are used in the application.
Sub-Micron Sensor Assembly
Bonding of a 20x20mm sensor containing 143,616 bumps and 50 micron pitch. Pickup process uses uses controlled force and a parallelism control tool.
FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder
The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.
FINEPLACER® femto 2 - Die Flipping Unit
Integrated die flip module automatically flips chips of various sizes and thickness. Can be used for chips that are presented with the bond side facing upward. Interchangeable platforms of the unit allow for component-specific adaptation.
FINEPLACER® femto 2 - Handling & Dispensing Module
Multilevel chip placement application with 5 micron accuracy and auto alignment. Sorting and assistance processes can also be supported. The handling module picks up die with controlled force, rotates and places the device. The dispenser module allows the application of glue and paste.
FINEPLACER® femto 2 - Tacking, Bump Bonding
Population of a sensor substrate with several readout chips. Integrated oven process for preparation (bump forming with formic acid) and connection of the fine-pitch bump arrays via tack bonding (indium). Followed by a global reflow process in inert atmosphere.
FINEPLACER® femto 2 - 3D Joystick
The 3D joystick allows fast, easy machine operation - a helpful tool when combined with the vision system and measuring function. Switching over from automatic to manual mode is possible at any time. Perfect bonding results with no programming effort.
FINEPLACER® lambda - R&D Bonder
The modularly designed FINEPLACER® lambda bonder provides a wide spectrum of process capabilities and the highest flexibility in a single platform. Quality optics deliver sub-micron accuracy and repeatability. Multiple bonding technologies make for an ideal research facility system.
AuSn Laser Bar Bonding
Gold-tin laser bar bonding requires high accuracy and process control. This video addresses eutectic bonding: the application of heat to both laser and C-mount, using a controlled downward pressure, an inert atmosphere and forming gas to produce a flux-less process.
Fully automated laser bar to sub mount assembly process with 1mm x 10mm example. Shows high accuracy alignment steps, bonding with defined overhang, and live observation of soldering process.
Au-Au Thermosonic Flip Chip Bonding
Au on Au bonding process combines low temperature heat and moderate force aided by ultrasonic motion in the 60 - 100 kHz range - suitable for low to medium I/O count devices. Finetech systems provide optimized field of view for alignment and visual inspection in-situ.