New FINEPLACER® lambda 2 product introduction
The all-new FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.
Sub-Micron Sensor Assembly
Bonding of a 20x20mm sensor containing 143,616 bumps and 50 micron pitch. Pickup process uses controlled force and a parallelism control tool.
FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder
The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.
FINEPLACER® femto 2 - Handling & Dispensing Module
Multilevel chip placement application with 5 micron accuracy and auto alignment. Sorting and assistance processes can also be supported. The handling module picks up die with controlled force, rotates and places the device. The dispenser module allows the application of glue and paste.
FINEPLACER® femto 2 - Tacking, Bump Bonding
Population of a sensor substrate with several readout chips. Integrated oven process for preparation (bump forming with formic acid) and connection of the fine-pitch bump arrays via tack bonding (indium). Followed by a global reflow process in inert atmosphere.
Au-Au Thermosonic Flip Chip Bonding
Au on Au bonding process combines low temperature heat and moderate force aided by ultrasonic motion in the 60 - 100 kHz range - suitable for low to medium I/O count devices. Finetech systems provide optimized field of view for alignment and visual inspection in-situ.