CSP Rework on Mobile Phones
Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. All aspects of the rework cycle shown with the FINEPLACER® core rework system.
Rework of GPU
Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.
Contactless Residual Solder Removal
Contactless solder removal (site dressing) showing alignment of tool and component, application of flux and the removal process.