Over the course of a quarter century, we have gained a deep understanding of our customers' needs.
This experience helps us to develop equipment and processes for specific requirements.
Silitronics uses a Finetech die bonder for extremely complex flip chip, sensor and opto-electronics applications, along with co-development of new assembly processes for leading semiconductor customers. The bonder has allowed us to help customers develop, optimize, verify and enhance many state-of-the-art technologies. Our partnership with Finetech has been very rewarding and their willingness to provide constructive application support in a timely manner, along with their design and manufacture of quality custom tooling, are second to none.
Dhiraj Bora
CEO & President, Silitronics
