Hot Air SMD Rework Station
The FINEPLACER® coreplus is a universal hot air rework station for electronic components and assemblies.
The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).
The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices).
A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher.
The trend towards ever increasing data rates demands large bandwidths and thus usage of higher and higher frequencies. ICs are getting smaller and BGA-packages more common in an RF-Engineer‘s day to day work. The FINEPLACER® core gives us the means to handle those ICs reliably, saving us time and nerves. It is a great extension of our assembly technology.Prof. Dr.-Ing. habil. Alexander Kölpin, Head of Institute for High Frequency Technology, Hamburg University of Technology
- Full hot air rework system
- Unique FINEPLACER® working principle
- Industry-leading thermal management
- In-situ process observation in HD
- Data/media logging and reporting function
- Full process access & easy visual programming with touch screen interface
- Sequence control with predefined parameters
- Placement accuracy better 10 µm
- Versatile machine platform
- Customer specific tooling
- Overlay vision alignment system (VAS) with fixed beam splitter
- 3-color LED illumination
- Full process access and easy programming
- Synchronized control of all process related parameters
- Software controlled top heater calibration
- Modular machine platform allows in-field retrofitting during entire service life
- Individual configurations with process modules
- Fully manual or semi-automatic machine versions
- Force controlled component handling
Applications & Processes
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any photonics application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of photonic applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).
Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.
Integration of dispensing systems for applying flux, solder paste, adhesive or other pasty material. Various supported types like time-pressure or volume dispensers.
Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.
Customized clamping solution for various shapes of PCBs.
For an economic use of nitrogen as hot gas, to save resources, energy and money.
Because reproducibility matters | Measures the temperature of a defined point on the board surface for reproducible process conditions.
Allows the in-situ observation of the working area during the soldering process.
Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.
Allows precise residual solder removal in an inert atmosphere. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.
Allow two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.
Allows the heat transfer from the top with hot gas and chip specific tool design to control temperature from the chip direction.
Allows the intuitive use of the software with established multi touch functions and a navigation based on real PCB images.
Allows presentation of components from GelPak®, VR trays, waffle packs or tape holders as well as the support of dipping trays or cleaning units.
Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.
This video demonstrates a safe and easy reballing process on a FINEPLACER® hot gas rework system in order to repair a BGA component. Also included is a contactless removal of residual solder from the BGA.
Rework of GPU
Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.
Rework of BGA/CSP and CPU/GPU SMD
The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics.
Rework of Mini-LED Arrays
Finetech rework systems for R&D and production environments are well suitable for miniature LED rework, such as those in form of SMD LED components (RGB) built into modern display systems.