Multi-Purpose Manual Die Bonder
The FINEPLACER® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, the system is ideal for fast and flexible product development and prototyping in R&D labs and universities.
We have designed the FINEPLACER® pico 2 to accommodate a large number of technology and process modules, as well as application-specific tools. Users can add third-party functionalities and further customize the bonding system at any time. If new functions are needed, the modular architecture allows on-site retrofitting throughout the entire service life.
Getting started is effortless.
The high-resolution vision alignment system supports adaptable fields of view and comes with adjustable RGB illumination. It can find the best color contrast between component and substrate and makes manual alignment straightforward and reliable.
The spacious working area supports 300 mm wafers and enables batch processes. This is complemented by a high-resolution bonding force module with a wide range of available forces, which can handle a full spectrum of different components.
Process creation is a breeze with the intuitive and powerful IPM Command bonding software. It allows users to concentrate on the core tasks involved in application development, thus minimizing operating errors. At the same time, users have access to an unparalleled range of parameter tweaking options for process optimization.
The FINEPLACER® pico 2 follows our "Prototype to Production" approach of a cross-system, unified hardware and software platform. It enables R&D processes to be seamlessly transferred with all their technological diversity from development lab to production environment.
By combining application flexibility, technological diversity, process reliability and compatibility with Finetech's automated production bonders, the FINEPLACER® pico 2 offers an outstanding return on investment and is a natural starting point on the journey from concept to final product.
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic), including reflow soldering
- Freely configurable RGB LED illumination for alignment
- Excellent price performance ratio
- Full process access & easy visual programming with touch screen interface
- In-situ process observation in HD
- Modular machine platform allows in-field retrofitting during entire service life
- Manual or semi-automatic machine versions
- Large bonding area
- Placement accuracy of 3 µm
- Unique FINEPLACER ® working principle
- Synchronized control of all process related parameters
- Overlay vision alignment system (VAS) with fixed beam splitter
- Data/media logging and reporting function
- Synchronized control of all process related parameters
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Wide range of controlled bonding forces
- Sequence control with predefined parameters
- Wide range of component presentation (wafer, waffle pack, Gel-Pak®)
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).
Enhances the existing bond force range and allows the use of software controlled process forces.
Provides various bonding force ranges and allows the mechanical adjustment of different process forces.
Allows extending the field of view in Y-direction.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.
Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Software extension for creating and using virtual forms in the camera image to support relative and face-up alignment processes.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
For precisely setting a defined gap between component and substrate.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Precise visual alignment of chip and substrate.
Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.
Enhances a process gas module to handle two different gases for programmed selection in the process.
Allows the in-situ observation of the working area during the bonding process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Use different tools or tool tips in process.
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.
Bonding with Anisotropic Adhesive
In modern displays, Flex-on-glass and Chip-on-Glass are preferred bonding technologies. This goes along with using anisotropic conductive foils or pastes which have a fundamentally different functional principle compared to common adhesives or solder materials.
Ultrasonic / thermosonic bonding is a process primarily used for bond wires but also for flip chip bonding. Ultrasonic allows to generate a mechanically and electrically stable connection.