Multi-Purpose Manual Die Bonder
The FINEPLACER® pico ma is a multi-purpose manual die bonder with a placement accuracy down to 3 µm for assembly tasks in prototyping, small volume production, R&D laboratories and universities.
Thanks to its modular system architecture, the FINEPLACER® pico ma can be configured for a wide range of die attach and flip chip bonding technologies and applications. To meet new requirements, this manual die bonder can be retrofitted and upgraded throughout its service life. A generous working area supports the precision assembly on particularly large substrates, while the open design makes it easy to flexibly expand the die bonding system with third-party functionalities.
"The FINEPLACER® pico ma guarantees us maximum flexibility. With its variable bonding force range, we are capable of bonding very small to larger components. All of them can be precisely aligned, which is essential when dealing with small pitch and miniaturized contacts."Sebastian Quednau
With its integrated process management for synchronized control of all process parameters, this die bonding system stands for reproducibility and high yield even with manual process control. Short setup and changeover times and intuitive process creation save you valuable minutes in the lab every day, especially with frequently changing applications.
For working with particularly demanding product designs and assembly processes, the flip chip bonder FINEPLACER® pico ma is also available with a placement accuracy of 3 µm instead of the usual 5 µm. When you are frequently working within very tight tolerances, the optionally available Zoom-Opticsplus gives you more process reliability, design freedom, and an extended process window.
With its application flexibility as well as technology and function diversity in combination with highest process reproducibility, this manual die bonder offers you an outstanding return on investment. From research to product development to high-mix/low-volume production – let the FINEPLACER® pico ma die bonding system be the key to your success.
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic), including reflow soldering
- Excellent price performance ratio
- Fully manual or semi-automatic machine versions
- Individual configurations with process modules
- Full process access and easy programming
- In-situ process observation in HD
- Wide range of supported component sizes
- Data/media logging and reporting function
- Wide range of controlled bonding forces
- Modular machine platform allows in-field retrofitting during entire service life
- Synchronized control of all process related parameters
- Overlay vision alignment system (VAS) with fixed beam splitter
- Placement accuracy better 3 µm
- Wide range of component presentation (wafer, waffle pack, gel-pak®)
- Dual-camera system for alignment
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Used to place non-transparent or transparent ACF with defined force and temperature after chip alignment
Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).
Enhances the existing bond force range and allows the use of software controlled process forces.
Provides various bonding force ranges and allows the mechanical adjustment of different process forces.
Allows extending the field of view in Y-direction.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.
Used to flip components prior to face-down assembly.
Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.
The “Known Good Die" testing allows chip probing / testing prior to the bonding process.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Designed to bond components with a defined distance to the substrate.
Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Software extension for creating and projecting virtual masks to simplify alignment processes. These masks can be combined from several objects at pixel level.
Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Allows the in-situ observation of the working area during the bonding process.
Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.
Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.
Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.
Bonding with Anisotropic Adhesive
In modern displays, Flex-on-glass and Chip-on-Glass are preferred bonding technologies. This goes along with using anisotropic conductive foils or pastes which have a fundamentally different functional principle compared to common adhesives or solder materials.
Ultrasonic / thermosonic bonding is a process primarily used for bond wires but also for flip chip bonding. Ultrasonic allows to generate a mechanically and electrically stable connection.