Flip Chip Bonder for R&D labs
FINEPLACER® pico ma
The Powerful Tool for Lab & Research

Multi-Purpose Bonder

The FINEPLACER® pico ma is our most cost effective bonder designed for prototyping or low-volume production, R&D labs and universities.

This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.

"The FINEPLACER® pico ma guarantees us maximum flexibility. With its variable bonding force range, we are capable of bonding very small to larger components. All of them can be precisely aligned, which is essential when dealing with small pitch and miniaturized contacts."

Sebastian Quednau
NanoWired GmbH
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Key facts

  • Excellent cost-performance ratio
  • All kinds of chip bonding technologies, including reflow soldering
  • Placement accuracybetter 5 µm
  • Wide range of supported component sizes
  • Full process traceability and protocol function incl. photo and video capturing
  • Ready-to-work design and easy-to-use operator interface
  • Plug & Play configuration of process modules

Applications & Technologies

RFID moduleMEMSLaser diode bar assemblyLaser diode assemblyMOEMSVCSEL / photo diode (array) assemblyNFC deviceGas pressure sensor assemblyImage sensor assemblyX-ray detector assemblyInk jet print head assemblyAcceleration sensor assemblyRF / HF module
Chip on Glass (CoG)Wafer level packaging (C2W)Precision die bonding (face up)2.5D and 3D IC packaging (stacking)Flip chip bonding (face down)Chip on Flex / Film (CoF)

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

ACF Module

Used to place non-transparent or transparent ACF with defined force and temperature after chip alignment

Bonding Force Module (automatic)

Enhances the existing bond force range and allows the use of software controlled process forces.

Bonding Force Module (manual)

Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Eject Module

Pick up components directly from blue tape.

Die Flip Module

Used to flip components prior to face-down assembly.

Dipping/Stamping Module

Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Flip Chip Test Module

The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Mask Generator

Description coming soon.

Optical Overlay Alignment VAS

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Scrubbing Module

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

Enables coarse position alignment of the table to the tool with the help of a laser spot.

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet light in various wave length for adhesive processes without thermal influence.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Zoom Optics

Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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