Multi-Purpose Bonder FINEPLACER pico ma
The Powerful Tool for Lab & Research

Multi-Purpose Manual Die Bonder

The FINEPLACER® pico ma is a multi-purpose manual die bonder with a placement accuracy down to 3 µm for assembly tasks in prototyping, small volume production, R&D laboratories and universities.

Thanks to its modular system architecture, the FINEPLACER® pico ma can be configured for a wide range of die attach and flip chip bonding technologies and applications. To meet new requirements, this manual die bonder can be retrofitted and upgraded throughout its service life. A generous working area supports the precision assembly on particularly large substrates, while the open design makes it easy to flexibly expand the die bonding system with third-party functionalities.

"The FINEPLACER® pico ma guarantees us maximum flexibility. With its variable bonding force range, we are capable of bonding very small to larger components. All of them can be precisely aligned, which is essential when dealing with small pitch and miniaturized contacts."

Sebastian Quednau
NanoWired GmbH

With its integrated process management for synchronized control of all process parameters, this die bonding system stands for reproducibility and high yield even with manual process control. Short setup and changeover times and intuitive process creation save you valuable minutes in the lab every day, especially with frequently changing applications.

Your Sales Contact Robert Avila

Finetech USA/West Coast
+1 480 893-1630
Send an email

For working with particularly demanding product designs and assembly processes, the flip chip bonder FINEPLACER® pico ma is also available with a placement accuracy of 3 µm instead of the usual 5 µm. When you are frequently working within very tight tolerances, the optionally available Zoom-Opticsplus gives you more process reliability, design freedom, and an extended process window.

With its application flexibility as well as technology and function diversity in combination with highest process reproducibility, this manual die bonder offers you an outstanding return on investment. From research to product development to high-mix/low-volume production – let the FINEPLACER® pico ma die bonding system be the key to your success.

Key Facts*

  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic), including reflow soldering
  • Excellent price performance ratio
  • Fully manual or semi-automatic machine versions
  • Individual configurations with process modules
  • Full process access and easy programming
  • In-situ process observation in HD
  • Wide range of supported component sizes
  • Data/media logging and reporting function
  • Wide range of controlled bonding forces
  • Modular machine platform allows in-field retrofitting during entire service life
  • Synchronized control of all process related parameters
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Placement accuracy better 3 µm
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Dual-camera system for alignment

Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.

Generic MEMS assemblyRFID moduleGeneric MOEMS assemblyNFC device packagingInk jet print head assemblyGas pressure sensor assemblyUltrasonic transceiver assemblyVisual image sensor assemblyAcceleration sensor assemblyX-ray detector assemblyRF / HF module assemblyMechanical assembly
Precision die bonding (face up)Wafer level packaging (FOWLP, W2W, C2W)Glass on GlassChip on Glass (CoG)Chip on Board (CoB)2.5D and 3D IC packaging (stacking)Flip chip bonding (face down)Chip on Flex / Film (CoF)Flex on Board

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

ACF Module

Used to place non-transparent or transparent ACF with defined force and temperature after chip alignment

Bar Code Reader "SmartIdent"

Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

Bonding Force Module (automatic)

Enhances the existing bond force range and allows the use of software controlled process forces.

Bonding Force Module (manual)

Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

Camera Y-Shift Module

Allows extending the field of view in Y-direction.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Eject Module

Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

Die Flip Module

Used to flip components prior to face-down assembly.

Direct Component Printing Module

Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Dual-Camera Optics

Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.

Flip Chip Test Module

The “Known Good Die" testing allows chip probing / testing prior to the bonding process.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Gap Adjustment Module

Designed to bond components with a defined distance to the substrate.

Hot Gas Bottom Heating Module

Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Mask Generator

Software extension for creating and projecting virtual masks to simplify alignment processes. These masks can be combined from several objects at pixel level.

Motorized Z Table

Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Overlay Vision Alignment System (VAS)

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Reballing Module

Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.

Scrubbing Module

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

Traceability Module

Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Zoom Optics

Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.

High-precision die bonder for the Electronic Coast®
How the University of South-Eastern Norway relies on Finetech assembly and packaging equipment to facilitate innovation in one of country’s top microtechnology regions.
Your Sales Contact Robert Avila

Finetech USA/West Coast
+1 480 893-1630
Send an email

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