FINEPLACER® lambda 2
The Ultimate Tool for Opto Assemblies

Sub-Micron Bonder

The all-new FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.

The completely revised bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility to protect your investment in the face of ever-changing challenges.

Due to an ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.

The FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech's automatic bonding systems to ensure a seamless process migration to series production. Ask us about our scalable solutions.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Key Facts

  • Superior optical resolution
  • Highest placement accuracy
  • Numerous chip bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Unique cost-performance ratio
  • Full process traceability and protocol function incl. photo capturing
  • Operating software with full process access and intuitive programming
  • Plug & Play configuration of process modules
  • Wide range bonding force control

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Adaptable Object Lenses

Allows the exchange of the achromatic lens to work with different fields of view and optical resolutions.

Bonding Force Module (automatic)

Enhances the existing bond force range and allows the use of software controlled process forces.

Bonding Force Module (manual)

Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

Camera Y-Shift Module

Allows extending the field of view in Y-direction.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Flip Module

Used to flip components prior to face-down assembly.

Dipping/Stamping Module

Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.

 

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Gap Adjustment Module

Designed to bond components with a defined distance to the substrate.

Optical Overlay Alignment VAS

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

Enables coarse position alignment of the table to the tool with the help of a laser spot.

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet light in various wave length for adhesive processes without thermal influence.

Zoom Optics

Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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