Advanced Sub-Micron Bonder FINEPLACER sigma
Unrivaled Flexibility for Research & Prototyping

Advanced Sub-Micron Bonder

The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N.

The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more.

Placing small devices on large substrates is made possible by the FPXvisionTM optical system design. With this alignment system, the smallest structures at the highest magnification can be viewed across the entire field of view. Moreover, FPXvisionTM introduces pattern recognition to a die bonder with manual alignment.

The FINEPLACER® sigma embraces all features of an assembly and development platform capable of handling an unlimited spectrum of applications and prepared for future technologies.

"We use the FINEPLACER® sigma for a variety of applications, ranging from simple chip-to-submount to complex module assemblies with very high accuracy requirements. Easy manual operation makes the system also an ideal fit for low-quantity research samples."

Lars Schellhase
Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

Key Facts*

  • Large bonding area
  • Reproducible sub-micron placement accuracy
  • Pattern recognition for software verified alignment
  • Wide range of supported component sizes
  • UHD vision alignment system with FPXvisionTM
  • Modular machine platform allows in-field retrofitting during entire service life
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Synchronized control of all process related parameters
  • Process module compatibility across Finetech platforms
  • Individual configurations with process modules
  • Ultra low bonding force
  • Data/media logging and reporting function
  • Wide range of controlled bonding forces
  • In-situ process observation in HD
  • Full process access & easy visual programming with touch screen interface
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • 3-color LED illumination
  • Sequence control with predefined parameters

Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.

Micro-optical bench assemblyIR detector assemblyGas pressure sensor assemblyVCSEL/photo diode (array) assemblyVisual image sensor assemblyGeneric MEMS assemblyMicro optics assemblySingle photon detector assemblyUltrasonic transceiver assemblyLaser diode assemblyµLED (array) assemblyLaser diode bar assemblyHigh-power laser module assemblyAcceleration sensor assemblyGeneric MOEMS assemblyInk jet print head assemblyX-ray detector assemblyOptical sub assembly (TOSA/ROSA)E-beam module assemblyMechanical assembly
Chip on Flex/Film (CoF)Chip on Glass (CoG)Multi chip packaging (MCM, MCP)Flip chip bonding (face down)2.5D and 3D IC packaging (stacking)Wafer level packaging (FOWLP, W2W, C2W)Precision die bonding (face up)Flex on boardChip on board (CoB)

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

Bonding Force Module (automatic)

Enhances the existing bond force range and allows the use of software controlled process forces.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.

Die Eject Module

Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

Die Flip Module

Allows flipping of components prior to face-down assembly.

Direct Component Printing Module

Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.


Ensures a high resolution at all magnification levels.

Height Sensor (Autofocus)

Allows automatic focus setting of component and substrate as well as height measurements.

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Mask Generator "Scaled"

Software extension for creating and projecting virtual masks to simplify alignment processes. These masks can be combined to scale from several objects.

Motorized Z Table

Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Pattern Recognition

Software tool to recognize various alignment marks. Used to control the position or alignment between component and substrate.

Process Gas Module

Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.

Process Gas Selection

Enhances a process gas module to handle two different gases for programmed selection in the process.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration.  Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

Tool Tip Changer

Use different tools or tool tips in process.

Traceability Module

Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

Vacuum Chamber Module

Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

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