Large Area Multi-Chip Bonder FineXT 6003
FineXT 6003
Speed and Precision in Production

Large-Area Multi-Chip Production Die Bonder

The FineXT 6003 is a fully automatic large area production die bonder with true multi-chip, multi placement capability for high volume manufacturing.

The modular design allows to configure this production die bonder for multiple advanced packaging technologies. The machine’s capabilities can be easily enhanced to adapt to new technological trends in semiconductor manufacturing. Combined with an automatic material handling and tool management system, this ensures the production die bonder’s high degree of process flexibility for next-generation optoelectronic and demanding fan-out applications.

In operation, a speed mode and a precision mode can be flexibly combined. Given the frequently changing precision requirements during the assembly of multi-chip modules, this capability ensures optimal throughput and makes the production die bonder FineXT 6003 the perfect solution for modern semiconductor manufacturing environments.

Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

Key Facts*

  • Placement accuracy of 3 µm
  • Very large bond area for wafers and panels
  • Multi wafer capability
  • Automatic placement accuracy calibration
  • Fully automatic material management
  • Automatic tool management
  • Adjustable Speed for Production
  • Multi-chip capability
  • Granite base and air bearings
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Modular machine platform allows in-field retrofitting during entire service life
  • Synchronized control of all process related parameters
  • Numerous bonding technologies (adhesive, soldering, thermocompression)
  • Various bonding technologies in one recipe
  • Integrated scrubbing function
  • Individual configurations with process modules
  • Process and material traceability via TCP (for MES)
  • Full process access & easy visual programming with touch screen interface
  • Data/media logging and reporting function
  • 3-color LED illumination
  • In-line capability with automatic substrate transport system

Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.

Chip on Glass (CoG)Embedded die packagingPrecision die bonding (face up)Wafer level packaging (FOWLP, W2W, C2W)Flip chip bonding (face down)Multi chip packaging (MCM, MCP)2.5D and 3D IC packaging (stacking)Chip on Board (CoB)Chip on Flex/Film (CoF)Panel level packaging (FOPLP)

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

Automatic Dipping Unit

Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.

Automatic Tool Changer

Use different tools or tool tips, automatic exchange in process.

Camera Module (Up-Looking)

For determining surface coordinates on the underside of captured objects using image recognition (RGB/coaxial illumination).

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.

Die Eject Module with Carousel

Used to pick up components with the placement arm directly from blue tape with the use of different eject tools. Supports snap rings and wafer frames.

Die Flip Module

Allows flipping of components prior to face-down assembly.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Handling Module

Used to handle substrates or components independently from the bonding tool.

Height Sensor (Autofocus)

Allows automatic focus setting of component and substrate as well as height measurements.

Height Sensor (Laser)

Allows sensing of heights by means of Laser triangulation for measuring purposes.

I/O Lift System

Automatic substrate or boat unloading from magazines / loading into magazines.

I/O Panel Handling System

Automatic loading and unloading of large panels or substrates.

ID Code Reader

Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Process Gas Module

Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.

Process Gas Selection

Enhances a process gas module to handle two different gases for programmed selection in the process.

Programmable Wafer Changer with Cassette Lift

Accommodates 300 mm wafer cassettes. Programmable speed and slots.

Scrubbing Module

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration.  Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

Traceability Module

Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

UV Curing Module

Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

Wafer Changer

Accommodates 300 mm wafer cassettes. Programmable speed and up to 24 slots.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Wafer Table

Automatically positions and indexes the wafer over the Die-Ejector.

Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

A free user account is needed

With a user account you can download:

  • product flyers
  • technical data sheets (after activation)
  • technical papers (after activation)

Non-Business Email Address Detected
We strongly recommend to use a business email address for the registration. Our IT security policy restricts the use of public email addresses. You may not receive a response.