Large-Area Multi-Chip Production Die Bonder
The FineXT 6003 is a fully automatic large area production die bonder with true multi-chip, multi placement capability for high volume manufacturing.
The modular design allows to configure this production die bonder for multiple advanced packaging technologies. The machine’s capabilities can be easily enhanced to adapt to new technological trends in semiconductor manufacturing. Combined with an automatic material handling and tool management system, this ensures the production die bonder’s high degree of process flexibility for next-generation optoelectronic and demanding fan-out applications.
In operation, a speed mode and a precision mode can be flexibly combined. Given the frequently changing precision requirements during the assembly of multi-chip modules, this capability ensures optimal throughput and makes the production die bonder FineXT 6003 the perfect solution for modern semiconductor manufacturing environments.
Key Facts*
- Placement accuracy of 3 µm
- Very large bond area for wafers and panels
- Multi wafer capability
- Automatic placement accuracy calibration
- Fully automatic material management
- Automatic tool management
- Adjustable Speed for Production
- Multi-chip capability
- Granite base and air bearings
- Wide range of component presentation (wafer, waffle pack, gel-pak®)
- Modular machine platform allows in-field retrofitting during entire service life
- Synchronized control of all process related parameters
- Numerous bonding technologies (adhesive, soldering, thermocompression)
- Various bonding technologies in one recipe
- Integrated scrubbing function
- Individual configurations with process modules
- Process and material traceability via TCP (for MES)
- Full process access & easy visual programming with touch screen interface
- Data/media logging and reporting function
- 3-color LED illumination
- In-line capability with automatic substrate transport system
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.
Use different tools or tool tips, automatic exchange in process.
For determining surface coordinates on the underside of captured objects using image recognition (RGB/coaxial illumination).
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.
Used to pick up components with the placement arm directly from blue tape with the use of different eject tools. Supports snap rings and wafer frames.
Allows flipping of components prior to face-down assembly.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Used to handle substrates or components independently from the bonding tool.
Allows automatic focus setting of component and substrate as well as height measurements.
Allows sensing of heights by means of Laser triangulation for measuring purposes.
Automatic substrate or boat unloading from magazines / loading into magazines.
Automatic loading and unloading of large panels or substrates.
Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.
Enhances a process gas module to handle two different gases for programmed selection in the process.
Accommodates 300 mm wafer cassettes. Programmable speed and slots.
Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Accommodates 300 mm wafer cassettes. Programmable speed and up to 24 slots.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.
Automatically positions and indexes the wafer over the Die-Ejector.
Technical Paper
Eutectic Bonding with Au/Sn
Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.
Finetech GmbH & Co. KG
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