Accessory Systems

As a complement to our advanced rework equipment, or on their own, these rework accessory systems provide unique pre-heating, reballing and desoldering solutions.

MiniOven 05

The MINIOVEN 05 is a robust, compact table-top system designed for easy re-balling of BGA components and pre-bumping of QFN components.

Hot Beam 05

Infrared underheater: 2,000 W heating power to heat heavy PCBs. Unique features include a very compact design, large power density and a fast response heating source.

Hot Beam 04

Infrared underheater: 500 W heating power for the efficient and precise heating of PCBs. Unique features include a very compact design, fast response and targeted heating.

Hot Plate

HOT PLATE 04 is a powerful 700 W conductive underheater that allows efficient work on heavy electrical systems with a flat bottom surface and LED PCBs.

Smart Desolder 01

Non-contact extraction of residual solder using a manual hot-gas source with a vacuum pen. Remove components without re-applying heat and pressure to PCB.