SMD Rework station in field repair
FINEPLACER® coreplus

Compact Hot Air Rework Station

The FINEPLACER® coreplus is an all-around hot air rework station for electronic components and assemblies.

The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).

The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices).

A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher.

Highlights*

  • Advanced rework
  • JEDEC/IPC conform processes
  • Live process monitoring
  • Process traceability
  • Automated soldering processes
  • Intuitive user experience
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
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Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Bar Code Reader "SmartIdent"

Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

Board Printing Tools

Designed for local and precise positioned paste applying.

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Direct Component Printing Module

Is an “All in One“ solution for reworking QFN, SON and MLF components.

Dispense Support Module

Motorized feed unit to move dispenser into working or parking position.

Dispense Unit

Various types of dispensing systems (e.g. volume or jet dispenser) to apply solder paste or other material.

Optical Overlay Alignment VAS

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of component and board.

PCB Support

Dedicated PCB holders for any kind of board.

Process Start Sensor

Measures the temperature of a defined point on the board surface for reproducible process conditions.

Process Video Module

Allows the in-situ observation of the working area during the soldering process.

Reballing Module

Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.

Solder Removal Module

Allows precise residual solder removal in an inert atmosphere. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

 

Split Field Optics

Allow two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.

Target Finder

Enables coarse position alignment of the table to the tool with the help of a laser spot.

Touch Screen "Smart Control"

Allows the intuitive use of the software with established multi touch functions and a navigation based on real PCB images.

Zoom Optics

Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.

VIDEOS

BGA Rework Cycle

Desoldering, soldering, residual solder removal on flat panel TV PCB.

TECH PAPER:

BGA Reballing

This video demonstrates a safe and easy reballing process on a FINEPLACER® hot gas rework system in order to repair a BGA component. Also included is a contactless removal of residual solder from the BGA.

TECH PAPER: 

Rework of GPU

Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.

TECH PAPER:

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