Clean room lab die bonders
Your vision brought to life

Our R&D Bonders are ready to tackle the challenges of today and tomorrow.
Flexible, accurate and retrofittable at all times.

Finetech die bonders for research & development are first choice wherever highest placement accuracy, technological diversity and rapid implementation of different assembly processes are required.

For an optimal range of applications, all machines can be configured flexibly according to your needs and retrofitted for additional tasks.

FINEPLACER lambda 2, sub-micron die bonder, high power laser diodes assembly, laser diode arrays, laser bar bonding, eutectic AuSn soldering
Mars: Behind the Scenes
High-power laser modules by Quantel Laser help achieve important scientific tasks aboard Mars-exploring “Curiosity” rover.
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With a user account you can download:

  • product flyers
  • technical data sheets (after activation)
  • technical papers (after activation)

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