High Accuracy Photonics Die Bonder
The FINEPLACER® femtoblu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability for photonic applications.
Designed for prototyping and high-yield production duties, this die attach system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components. A complete machine enclosure minimizes external influences to ensure a stable process environment and protects the operator against gas, vapor and UV radiation.
The DualCam visual alignment system with twin-camera module and beam splitter provides application-specific fields of view, digital zoom, various LED illumination options as well as optics shifting along the X-axis for optimal view of a wide spectrum of component sizes.
IPM Command, the advanced FINEPLACER® operating software specifically developed for a wide spectrum of die bonding tasks, supports a consistent, ergonomic and clearly structured process development. It enables the synchronized control of all process parameters and additional process modules and provides pattern recognition for the automated alignment of substrates and components based on their structures and patterns.
Depending on the requirements, the modular FINEPLACER® femtoblu can be individually configured and upgraded in-field to support additional applications and technologies in the field of photonics. It covers the entire die bonding workflow of inspection, characterization, packaging, final test and qualification in the development and manufacturing of data communication products and beyond.
- Placement accuracy of 2 µm @ 3 Sigma
- Multi-chip capability
- Excellent price performance ratio
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Dual-camera system for alignment
- Modular machine platform allows in-field retrofitting during entire service life
- Ultra low bonding force
- Wide range of component presentation (wafer, waffle pack, gel-pak®)
- Large bonding area
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Automatic tool management
- Various bonding technologies in one recipe
- Wide range of supported component sizes
- Overlay vision alignment system (VAS) with fixed beam splitter
- In-situ process observation in HD
- Full process access and easy programming
- Data/media logging and reporting function
- Synchronized control of all process related parameters
- Process and material traceability via TCP (for MES)
- Integrated scrubbing function
- Fully automatic and manual operation
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.
Use different tools or tool tips, automatic exchange in process.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.
Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.
Allows flipping of components prior to face-down assembly.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.
The “Known Good Die" testing allows chip probing / testing prior to the bonding process.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Used to handle and rotate substrates up to 360° independently from the bonding tool.
Allows automatic focus setting of component and substrate as well as height measurements.
Allows sensing of heights by means of Laser triangulation for measuring purposes.
Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.
Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.
Activation / ignition of reactive materials such as nanofoils by laser pulse.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Precise visual alignment of chip and substrate.
Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.
Enhances a process gas module to handle two different gases for programmed selection in the process.
Allows the in-situ observation of the working area during the bonding process.
Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Laser Bar Bonding
Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
Multi Emitter Module Assembly
In order to reduce second-level packaging costs for optoelectronics manufacturing, Finetech has evaluated and is now offering an automatic solution for the packaging of CoS onto a heat sink via reactive multilayer systems (RMS).