FINEPLACER® femtoblu
The Efficient Solution for Photonics Production

Automatic Multi-Purpose Bonder

The FINEPLACER® femtoblu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability for photonic applications.

Designed for prototyping and high-yield production duties, this die attach system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components. A complete machine enclosure minimizes external influences to ensure a stable process environment and protects the operator against gas, vapor and UV radiation.

The DualCam visual alignment system with twin-camera module and beam splitter provides application-specific fields of view, digital zoom, various LED illumination options as well as optics shifting along the X-axis for optimal view of a wide spectrum of component sizes.

IPM Command, the advanced FINEPLACER® operating software specifically developed for a wide spectrum of die bonding tasks, supports a consistent, ergonomic and clearly structured process development. It enables the synchronized control of all process parameters and additional process modules and provides pattern recognition for the automated alignment of substrates and components based on their structures and patterns.

Depending on the requirements, the modular FINEPLACER® femtoblu can be individually configured and upgraded in-field to support additional applications and technologies in the field of photonics. It covers the entire die bonding workflow of inspection, characterization, packaging, final test and qualification in the development and manufacturing of data communication products and beyond.

Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

Key Facts*

  • Placement accuracy of 2 µm @ 3 Sigma
  • Multi-chip capability
  • Excellent price performance ratio
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Dual-camera system for alignment
  • Modular machine platform allows in-field retrofitting during entire service life
  • Ultra low bonding force
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Large bonding area
  • Process module compatibility across Finetech platforms
  • Individual configurations with process modules
  • Automatic tool management
  • Various bonding technologies in one recipe
  • Wide range of supported component sizes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • In-situ process observation in HD
  • Full process access and easy programming
  • Data/media logging and reporting function
  • Synchronized control of all process related parameters
  • Process and material traceability via TCP (for MES)
  • Integrated scrubbing function
  • Fully automatic and manual operation


Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.

Gas pressure sensor assemblyLaser diode assemblyGeneric MEMS assemblyVCSEL/photo diode (array) assemblyLaser diode bar assemblyMicro optics assemblyAcceleration sensor assemblyHigh-power laser module assemblySingle photon detector assemblyUltrasonic transceiver assemblyLens (array) assemblyNFC device packagingOptical sub assembly (TOSA/ROSA)Mechanical assembly
Chip on Flex/Film (CoF)Chip on Glass (CoG)Multi chip packaging (MCM, MCP)Flip chip bonding (face down)2.5D and 3D IC packaging (stacking)Wafer level packaging (FOWLP, W2W, C2W)Precision die bonding (face up)Flex on boardChip on board (CoB)

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

Automatic Dipping Unit

Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.

Automatic Tool Changer

Use different tools or tool tips, automatic exchange in process.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.

Die Eject Module

Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

Die Flip Module

Allows flipping of components prior to face-down assembly.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Dual-Camera Optics

Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.

Flip Chip Test Module

The “Known Good Die" testing allows chip probing / testing prior to the bonding process.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Handling Module

Used to handle and rotate substrates up to 360° independently from the bonding tool.

Height Sensor (Autofocus)

Allows automatic focus setting of component and substrate as well as height measurements.

Height Sensor (Laser)

Allows sensing of heights by means of Laser triangulation for measuring purposes.


Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.

ID Code Reader

Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.

Laser Activation Module

Activation / ignition of reactive materials such as nanofoils by laser pulse.

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Overlay vision alignment system (VAS) with fixed beam splitter

Precise visual alignment of chip and substrate.

Process Gas Module

Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.

Process Gas Selection

Enhances a process gas module to handle two different gases for programmed selection in the process.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Scrubbing Module

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration.  Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

Traceability Module

Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

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