Advanced Sub-Micron Bonder FINEPLACER femto 2
Unrivaled Flexibility for Prototyping & Production

Advanced Automatic Sub-Micron Bonder

The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.

A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, this automatic flip chip bonder stands for highly stable assembly processes with the focus on maximum yield.

The new generation of the femto automated die bonding platform adds numerous innovations to the proven technical basis. This includes the cutting-edge FPXvisionTM. Combined with a refined pattern recognition, this all-new Vision Alignment System opens up a new dimension of application flexibility and accuracy. IPM Command, the fully revamped FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development.

Depending on the requirements, the modular design of the automated die bonder FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes this automatic flip chip bonder a perfect tool and reliable companion as applications migrate from product development to production. This automated bonding system covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.

"The FINEPLACER® femto 2 has enabled our company to realize higher throughput automation of our high accuracy flip chip bonding operations. As our high reliability opto-electronic transceiver business is expanding, this has helped us to satisfy our customer’s growing needs."

Howard Lenos
Ultra Communications, Inc.
Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

Key Facts*

  • Placement accuracy of 0.3 µm @ 3 Sigma on small to large substrates
  • Automatic placement accuracy calibration
  • Wide range of controlled bonding forces
  • UHD vision alignment system with FPXvisionTM
  • Multi-chip capability
  • Safe and controlled process environment with cleanroom quality
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Modular machine platform allows in-field retrofitting during entire service life
  • Large bonding area
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Ultra low bonding force
  • Individual configurations with process modules
  • Various bonding technologies in one recipe
  • Integrated scrubbing function
  • Process module compatibility across Finetech platforms
  • Wide range of supported component sizes
  • Synchronized control of all process related parameters
  • Process and material traceability via TCP (for MES)
  • Full process access & easy visual programming with touch screen interface
  • Data/media logging and reporting function
  • 3-color LED illumination
  • In-situ process observation in HD
  • Fully automatic and manual operation
  • Automatic tool management

Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.

Generic MEMS assemblyGas pressure sensor assemblyHigh-power laser module assemblyMicro-optical bench assemblyUltrasonic transceiver assemblyIR detector assemblyLaser diode assemblyVisual image sensor assemblyAcceleration sensor assemblyVCSEL/photo diode (array) assemblyMechanical assemblyX-ray detector assemblyLaser diode bar assemblyGeneric MOEMS assemblySingle photon detector assemblyOptical sub assembly (TOSA/ROSA)Micro optics assemblyLens (array) assemblyInk jet print head assemblyE-beam module assembly
Chip on Flex/Film (CoF)Chip on Glass (CoG)Multi chip packaging (MCM, MCP)Flip chip bonding (face down)2.5D and 3D IC packaging (stacking)Wafer level packaging (FOWLP, W2W, C2W)Precision die bonding (face up)Flex on boardChip on board (CoB)

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

Automatic Dipping Unit

Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.

Automatic Tool Changer

Use different tools or tool tips, automatic exchange in process.

Bonding Force Module (automatic)

Enhances the existing bond force range and allows the use of software controlled process forces.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.

Die Eject Module

Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

Die Flip Module

Allows flipping of components prior to face-down assembly.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Flip Chip Test Module

The “Known Good Die" testing allows chip probing / testing prior to the bonding process.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.


Ensures a high resolution at all magnification levels.

Handling Module

Used to handle and rotate substrates up to 360° independently from the bonding tool.

Height Sensor (Autofocus)

Allows automatic focus setting of component and substrate as well as height measurements.

Height Sensor (Laser)

Allows sensing of heights by means of Laser triangulation for measuring purposes.


Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.

ID Code Reader

Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.

Laser Activation Module

Activation / ignition of reactive materials such as nanofoils by laser pulse.

Laser Heating Module

Allows ultra-fast heat cycles du to an integrated high power laser source

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Motorized Nick & Roll Motion

Tilting unit with motorized angular adjustment in the axes phi(X) and phi(Y). This nick and roll movement can be used for parallel positioning or for bonding at certain angular positions.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Process Gas Module

Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.

Process Gas Selection

Enhances a process gas module to handle two different gases for programmed selection in the process.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Scrubbing Module

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration.  Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

Traceability Module

Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

Vacuum Chamber Module

Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.


FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder

The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.

FINEPLACER® femto 2 - Die Flipping Unit

Integrated die flip module automatically flips chips of various sizes and thickness. Can be used for chips that are presented with the bond side facing upward. Interchangeable platforms of the unit allow for component-specific adaptation.

Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

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