The FINEPLACER® pico ma is our most cost effective bonder designed for prototyping or low-volume production, R&D labs and universities.
This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.
"The FINEPLACER® pico ma guarantees us maximum flexibility. With its variable bonding force range, we are capable of bonding very small to larger components. All of them can be precisely aligned, which is essential when dealing with small pitch and miniaturized contacts."Sebastian Quednau
- Excellent cost-performance ratio
- All kinds of chip bonding technologies, including reflow soldering
- Placement accuracybetter 5 µm
- Wide range of supported component sizes
- Full process traceability and protocol function incl. photo and video capturing
- Ready-to-work design and easy-to-use operator interface
- Plug & Play configuration of process modules
Applications & Technologies
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Used to place non-transparent or transparent ACF with defined force and temperature after chip alignment
Enhances the existing bond force range and allows the use of software controlled process forces.
Provides various bonding force ranges and allows the mechanical adjustment of different process forces.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Pick up components directly from blue tape.
Used to flip components prior to face-down assembly.
Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.
Allows the direct printing of solder onto no-lead components, such as QFN, MLF or SON.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Description coming soon.
Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Allows the in-situ observation of the working area during the bonding process.
Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.
Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
Enables coarse position alignment of the table to the tool with the help of a laser spot.
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet light in various wave length for adhesive processes without thermal influence.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.
Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.
RFID chips (Radio Frequency Identification) are increasingly used in industrial and consumer products. They come in sizes from several millimeters down to a few microns, with very thin and flexible substrates prone to thermal stress.
Bonding with Anisotropic Adhesive
In modern displays, Flex-on-glass and Chip-on-Glass are preferred bonding technologies. This goes along with using anisotropic conductive foils or pastes which have a fundamentally different functional principle compared to common adhesives or solder materials.