Advanced Sub-Micron Bonder
The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N.
The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more.
Placing small devices on large substrates is made possible by the FPXvisionTM optical system design. With this alignment system, the smallest structures at the highest magnification can be viewed across the entire field of view. Moreover, FPXvisionTM introduces pattern recognition to a die bonder with manual alignment.
The FINEPLACER® sigma embraces all features of an assembly and development platform capable of handling an unlimited spectrum of applications and prepared for future technologies.
"We use the FINEPLACER® sigma for a variety of applications, ranging from simple chip-to-submount to complex module assemblies with very high accuracy requirements. Easy manual operation makes the system also an ideal fit for low-quantity research samples."Lars Schellhase
Live Online Demo
Fill out the form to register for an online machine demo or make an appointment for a machine hands-on at one of our locations.
You want to save time and money? You don't want postponed trade shows or international travel restrictions to hamper your investment decision?
A live online product demonstration is a great and convenient way of experiencing our range of high-precision micro assembly die bonders and advanced rework stations from the comfort of your working desk.
- Large bonding area
- Reproducible sub-micron placement accuracy
- Pattern recognition for software verified alignment
- Wide range of supported component sizes
- UHD vision alignment system with FPXvisionTM
- Modular machine platform allows in-field retrofitting during entire service life
- Wide range of component presentation (wafer, waffle pack, gel-pak®)
- Synchronized control of all process related parameters
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Ultra low bonding force
- Data/media logging and reporting function
- Wide range of controlled bonding forces
- In-situ process observation in HD
- Full process access & easy visual programming with touch screen interface
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- 3-color LED illumination
- Sequence control with predefined parameters
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any photonics application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of photonic applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Enhances the existing bond force range and allows the use of software controlled process forces.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.
Used to flip components prior to face-down assembly.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Innovative digital beam splitter with two HD cameras provides highest optical resolution across a large field of view.
Allows automatic focus setting of component and substrate as well as height measurements.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Software extension for creating and projecting virtual masks to simplify alignment processes. These masks can be combined to scale from several objects.
Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Software tool to recognize various alignment marks. Used to control the position or alignment between component and substrate.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Enhances a process gas module to handle two different gases for programmed selection in the process.
Allows the in-situ observation of the working area during the bonding process.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Use different tools or tool tips in process.
Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.
Focal Plane Array / IR Sensor Assembly
A Focal Plane Array (FPA) is a sensor with a two-dimensional detector pixel matrix, i.e. for infra-red light or X-rays, positioned in the focal plane of an optical system.
Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.
Bonding Technologies for 3D Integration
An overview about different interconnects used during the system evaluation of the FINEPLACER® sigma.
Thermocompression bonding is a quick and easy method to reliably connect flip-chips. As the name suggests, this connecting method relies on force and temperature.