Sub-micron Die Bonder for R&D labs
FINEPLACER® lambda

Flexible Sub-micron Die Bonder

The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging.

It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production.

The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.

Highlights*

  • Sub-micron placement accuracy
  • Unique optical resolution
  • Handles ultra small components with special tooling
  • Closed loop force control
  • Small footprint and compact design
  • Optics movement with programmable positions
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
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Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Bonding Force Module (automatic)

Enhances the existing Bond force range and allows the use of software controlled process forces.

Bonding Force Module (manual)

Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Flip Module

Used to flip components prior to face-down assembly.

Dipping/Stamping Module

Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.

 

Dispense Support Module

Motorized feed unit to move dispenser into working or parking position.

Dispense Unit

Various types of dispensing systems to apply flux, solder paste, adhesive or other material.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Gap Adjustment Module

Designed to bond components with a defined distance to the substrate.

Interchangeable Object Lenses

Allows the exchange of the achromatic lens to work with different fields of view and optical resolutions.

Motorized Fine Rotation

Allows rotating the tool (and component) at the placement arm to correct angular errors.

Optical Overlay Alignment VAS

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.

Optics Shifting Module

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

Enables coarse position alignment of the table to the tool with the help of a laser spot.

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet light in various wave length for adhesive processes without thermal influence.

Videos

Face-up Assembly of VCSEL and PD

Bonding of VSCEL and Photo Diode using a sophisticated reference tool. Process involves vision control of placement. Silver epoxy and curing are used in the application.

TECHNICAL PAPER:

Face Down VCSEL Assembly on Transceiver Modules

Thermo-compression bonding process for VCSEL to transceiver substrate assembly.  Precise placement is achieved by aligning the VCSEL eye to the substrate aperture.

TECHNICAL PAPER:

FINEPLACER® lambda - R&D Bonder

The modularly designed FINEPLACER® lambda bonder provides a wide spectrum of process capabilities and the highest flexibility in a single platform. Quality optics deliver sub-micron accuracy and repeatability. Multiple bonding technologies make for an ideal research facility system.

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