Sub-Micron Bonder FINEPLACER lambda 2
FINEPLACER® lambda 2
The Ultimate Tool for Opto Assemblies

Sub-Micron Table Top Die Bonder

The all-new table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.

The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.

Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.

The table top die bonder FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech's automatic die bonding systems to ensure a seamless process migration to series production. Ask us about our scalable solutions.

We use the FINEPLACER® lambda 2 for development processes on MEMS, e.g. for precise dispensing and the placement of microstructures. The system fits in with the investment strategy at ISS, where flexible facilities with a wide range of materials enable research into new materials and, in particular, rapid prototyping. Going forward, this will enable us to develop new capabilities for our customers' ideas at an even faster rate.

Severin Schweiger, Fraunhofer IPMS, Integrated Silicon Systems
Your Sales Contact Robert Avila

Finetech USA/West Coast
+1 480 893-1630
Send an email

Key Facts*

  • Sub-micron placement accuracy 
  • Superior optical resolution
  • Excellent price performance ratio
  • Fully manual or semi-automatic machine versions
  • Individual configurations with process modules
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Data/media logging and reporting function
  • Wide range of controlled bonding forces
  • Full process access & easy visual programming with touch screen interface
  • Various bonding technologies in one recipe
  • Process module compatibility across Finetech platforms
  • In-situ process observation in HD
  • Modular machine platform allows in-field retrofitting during entire service life
  • Synchronized control of all process related parameters
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Sequence control with predefined parameters

Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.

µLED (array) assemblyGeneric MEMS assemblyVCSEL/photo diode/-array assemblyMicro optics assemblyGeneric MOEMS assemblyLaser diode assemblyVisual image sensor assemblyOptical sub assembly (TOSA/ROSA)Gas pressure sensor assemblyLaser diode bar assemblyMicro-optical bench assemblyAcceleration sensor assemblyLens (array) assembly
Chip on Flex/Film (CoF)Flip chip bonding (face down)2.5D and 3D IC packaging (stacking)Precision die bonding (face up)Chip on Glass (CoG)

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

Bonding Force Module (automatic)

Enhances the existing bond force range and allows the use of software controlled process forces.

Bonding Force Module (manual)

Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

Camera Y-Shift Module

Allows extending the field of view in Y-direction.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Flip Module

Used to flip components prior to face-down assembly.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Gap Adjustment Module

Designed to bond components with a defined distance to the substrate.

High Resolution Optics

Allows the exchange of the achromatic lens to work with different fields of view and optical resolutions.

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Overlay Vision Alignment System (VAS)

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Gas Selection

Enhances a process gas module to handle two different gases for programmed selection in the process.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

Tool Tip Changer

Use different tools or tool tips in process.

Traceability Module

Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

Zoom Optics

Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.

Your Sales Contact Robert Avila

Finetech USA/West Coast
+1 480 893-1630
Send an email

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