The Finetech Blog

This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.

// Optical Resolution for Bonding

High accuracy die placement requires precise magnification and resolution. It is nearly impossible to achieve sub-micron placement without accurate use of both of these elements.

// ACF / ACP Bonding

Using tiny polymer spheres coated with gold will allow an electrical connection to be made between a die and substrate.

// Thermosonic Bonding: Small Die

In my last blog I wrote about the challenges involved with thermo-sonic bonding of large die. Thermo-sonic bonding of smaller die presents…

// VCSEL and Photo Diode Alignment Simplified

Aligning a 4-channel VCSEL and a 4-channel photo diode together on a PCB, using conductive epoxy, is a challenging application for most telecom companies that develop and manufacture VSR or

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